Plated through holes (PTH) and vias are structures that interconnect signal circuits at different PCB layers. They are typically categorized as through vias (or PTH), blind vias, and buried vias. Due to the higher I/O density and smaller electronic packages evolving in the past decades, the demand for high density interconnects has increased significantly.
Working closely with our clients, we receive constant feedback about current challenges facing our industry. This allows us to tailor Sherlock updates to address rapidly developing landscapes as we continuously strive to improve Sherlock to make reliability predictions more accurate and more appropriate to Sherlock users’ needs.
As part of our mission to make Sherlock the most dependable and extensive reliability analysis tool available, we are rolling out an update to our flagship software. The two newest features in Sherlock addresses two key challenges: modeling non-standard BGA layouts and predicting the fatigue life of assemblies utilizing Insulated Metal Substrates (IMS).
Dr. Natalie Hernandez has been a Product Engineer at DfR Solutions since November 2016. Before, she completed her PhD in Physics at Lehigh University and served as a graduate research assistant working on spectroscopic studies of rare-earth doped wide bandgap semiconductor materials, and has since made the jump to electronics reliability engineering. After 7 months in her new role, here are some of the key takeaways she’s learned about the industry.