Global avionics continues to experience rapid growth. Being first to market with new, consistently reliable technology is key to staying ahead of the competition. Using non-destructive methods, like Digital Image Correlation (DIC), in avionic design and root cause analysis provides a fast, accurate way to help characterize material properties and measure displacements and deformation.
Digital Image Correlation is an optical method that employs tracking and image registration techniques for accurate 2D and 3D measurements of deformation and strain in avionics assemblies and boards. It is also commonly used to determine the Coefficient of Thermal Expansion (CTE) and of components and circuit cards. It is a useful tool in the design for reliability process, prior to physical prototyping, as it aids in material and component selection, test monitoring, and simulation inputs.
Digital Image Correlation and Avionics
The push for new technologies is pervasive in avionics. Everything from critical component strategies and design review to lifetime limiting components and alternative use environments is affected. DIC is ideal for avionics applications that require precise material characterization or displacement and deformation measurements such as:
- Environmental-related thermal stresses, more complex than either diurnal fluctuations or simple flight cycles, and must be accounted for and mitigated within the design
- Product-related thermal stresses including avionics systems and enclosures, and avionics stack configurations that retain and distribute heat throughout line replaceable units (LRUs) and drive up temperatures
- Mechanical stresses like those occurring from vibration and shock - particularly from landing gear deployment, speed brake use and landing impact (DIC can be used in dynamic applications with the right setup)
The benefits of using Digital Image Correlation
DIC can be applied to testing areas ranging from exceptionally small to very large, with results that are comparable to Finite Element Analysis (FEA) and are more comprehensive than strain gauging.
Leveraging DIC capabilities in avionics can help to:
- Collect data quickly
- Identify design deficiencies, margins and functional limitations
- Achieve lower warranty costs
- Meet customer or industry requirements
Digital Image Correlation provides valuable insights in both the design for reliability process and root cause analysis. To learn about another testing method that can help to ensure product reliability, download our Predicting Package Level Failure Modes in Multilayered Packages webinar. Click the button below for your free copy.