The performance of many electronic components is only as good as the enclosures that surround them. Reliability prediction of an electronic box is a crucial and sometimes underappreciated element that directly affects the performance of the circuitry and other costly systems inside.
As electronic components continue to evolve with the ever-changing high-tech manufacturing landscape, producers of the housings and enclosures need to keep pace. Engineers are tasked with protecting delicate systems by predicting and minimizing the effect of shock, vibration, humidity, temperature change, weather, and a host of other environmental factors.
AddressING Electronic Box Reliability
Vincent Doan, Hardware Development Reliability Engineer at HGST (formerly Hitachi Global Storage Technologies), shared his expertise during his presentation titled Implementing Physics of Failure (PoF) at Box-Level at DfR Solutions’ 2017 Design for Reliability Conference on March 20, 2017 in Baltimore. With more than 15 years of experience in product reliability and development, Doan demonstrated how implementing Physics of Failure (PoF) techniques for electronic boxes can help protect and ensure peak performance of components and subsystems.
If you want to learn more about how implementing physics of failure techniques help you evaluate the impact of environmental stresses to determine failure mechanisms and predict what a product’s lifespan will be under actual operating conditions, check out our recently recorded webinar by Michael Howard, Integrating Physics of Failure into Complex Systems. Click below to watch it now!