When analyzing the root cause of failure in many of today’s electronic systems, thermal issues stand out as being large contributing factors. Not only are today’s devices becoming more high-powered and complex, they’re doing it with smaller and smaller designs. However, packing large amounts of power into increasingly compact spaces can often put thermal strains on components. To help mitigate this risk and ensure a more reliable product, electronics manufacturers must conduct a thermal-mechanical analysis of their devices. However, given the amount of time and money this testing requires, many companies are looking for ways to speed up the process and make it more effective.
A More Efficient Approach to Thermal Testing
While traditional thermal tools can provide electronics manufacturers with a somewhat reliable analysis, the information they contribute isn’t as instrumental in protecting integrated circuits (ICs) and solder joints against temperature-related failure. For a more effective approach, engineers should use reliability physics to help interpret thermal modeling and measurement data. This means using a combination of Physics of Failure (PoF) techniques and industry-accepted models and standards to help predict components’ reliability.
In fact, our Sherlock Automated Design Analysis™ Software uses a PoF approach to indicate when thermal temperatures are too hot for ICs and solder joints, while also helping to find comprehensive solutions based on real data and calculations. To take things one step further, the Thermal-Analysis module in Sherlock 5.3 (launching soon!) will allow users to quickly and easily run thermal-mechanical analyses directly in the program, saving valuable engineering resources by eliminating time-consuming data-entry. Likewise, using the Thermal-Mechanical Analysis module will help afford more accurate thermal profiles of product designs, especially early on in product development where they can have the most impact.
In addition to its improved thermal testing capabilities, Sherlock 5.3 can also help:
- Reduce test times and product re-spins
- Accelerate product development
- Increase reliability, safety, and performance
- Reduce warranty costs
- And more!
To learn more about the new Thermal-Mechanical Analysis feature in Sherlock 5.3, please contact us and we’ll be happy to answer any questions that you might have. You can also download our free webinar to learn more about how you can help guarantee electronic reliability with thermal cycling.