My cousin recently came to me with a battery problem. He got a drone for Christmas, and he had not opened it for a while. "Last Christmas, right?", I asked. Apparently, it was the Christmas before (i.e a year and a half of being in a box). "Uh-oh," I say. I almost knew what was coming. The drone obviously did not work, and I got to see a picture of a very bloated Lithium Ion pouch cell. Your Lithium-Ion battery does need some attention from you every few months in the form of a periodic recharge, or you will end up with a cell that looks like the image below. (My colleagues have brought me plenty of gadgets with the plastic case popped open from a bloated battery)
“After a failure” investigations are typically performed to identify root cause of failure, calculate risk exposure and develop mitigation and remediation solutions. Just like with “before a failure” investigation, there are two specific test methods that could be applied to either of the two categories – non-destructive physical analysis (NPA) and destructive physical analysis (DPA).
Solder joint reliability is often a pain point in the design of an electronic system. A wide variety of factors affect solder joint reliability, and any one of them can drastically affect joint lifetime in a negative way. Properly identifying and mitigating potential causes of solder joint failure during the design and manufacturing process can prevent costly and difficult to solve problems later in a product lifecycle. Some of the most commonly observed solder joint failure contributors to consider are described here.
A common feeling among many designers and users of military electronic systems is nostalgia. Nostalgia for the good old days when the electronics industry was almost the exclusive supply chain of the military. While almost all aspects of integrated circuits (ICs) have improved over the past few decades (better, faster, cheaper), many in the military still long for the day when almost every semiconductor device on the market met or exceed their requirements without even asking.
Recently I, Greg Caswell, had full knee replacement surgery on my left knee to fix a problem with osteoarthritis. I found the overall experience interesting in that the approach the doctor’s used to assess the issue, develop a plan for improving the joints capabilities and finally performing surgery as the last possibility, was similar to the Physics of Failure approach DfR Solutions uses.
Performing a “before a failure” investigation on electronics is typically done for various reasons. One reason is to identify weak components or sub-systems before committing to a full-blown production run and its associated expenses. Comparison testing of similar component parts to reduce costs and increase reliability of existing designs, or against a competitor’s offerings is another reason. A “before a failure” investigation can validate a design to satisfy customer or market specifications, or regulatory obligations, which is common among the aerospace and medical devices fields.
Failure analysis is the process of identifying, and typically attempting to mitigate, the root cause of a failure. In the electronics industry, failure analysis typically involves isolating the failure to a location on a printed circuit board assembly (PCBA) before collecting more detailed data to investigate which component or board location is functioning improperly.
As 2017 is coming to a close, we are taking a look at our top viewed blog posts written by the expert engineers and reliability professionals at DfR Solutions.
Along with these blog posts, we have a large selection of resource materials available on electronics reliability, failure mechanisms and failure analysis.
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