In 1965, Intel® co-founder Gordon Moore noted that the number of transistors per square inch on integrated circuits (IC) doubled every year since their invention.
Fast forward five decades and Moore’s Law, as his observation became known, still holds true. On one hand, it’s a technological marvel. On the other, the steady practice of packing more transistors into increasingly smaller spaces is causing spikes in power density and leading to reliability issues. Testing and analysis must keep pace with technological advancements in order to mitigate risk.
The automotive industry, among others, is not immune to the challenges raised by Moore’s Law. Technologically, there’s pressure to include smaller form factors, greater functionality and higher density IC and PCB systems. From a business perspective, there’s a need for shorter design cycles and highly reliable products.
Impeding progress to any of these goals are traditional CAD tools that limit testing capabilities and efficiencies. Thermal cycling analysis using traditional CAD, for example, is labor intensive and time consuming – without promise of high reliability outcomes. It’s time and money not well spent.
Virtual PCB Prototyping and Simulation Using PoF
Virtual modeling and simulation combined with Physics of Failure (PoF) addresses the PCB needs of the automotive industry by surmounting the shortcomings of traditional CAD to reduce revisions and enhance reliability.
Applying PoF to PCB prototypes formed using modeling and simulation leverages the flexibility and focus of software to predict time to failure of electronics under thermal cycling and vibration loads. Virtual simulation with PoF isn’t theoretical or strictly worst case scenario. Real-world conditions are applied on-screen to answer reliability questions – and resolve issues – early in the design process rather than necessitating expensive build-test-fix prototyping iterations. Adjustments can be made and incorporated into the design and virtual prototype in real-time, and automotive manufacturers can achieve qualification in the first round.
Sherlock Automated Design Analysis™ software helps automotive manufacturers confidently meet their reliability goals with comprehensive analysis of thermal cycling, power-temperature cycling, vibration, shock, bending, thermal derating, accelerated life, natural frequency and more. Discover how Sherlock can work for you in Reduce Electronic Failures with Thermal Cycling. Click the button below to download your free copy.