Reliability Modeling of MEMS in Automotive Systems

Posted by James McLeish on Oct 14, 2016 9:30:00 AM

MEMS-Reliability-Modeling.jpgMicro-Electro-Mechanical Systems (MEMS) are increasingly used in safety-critical vehicle systems. This introduces new and evolving silicon and semiconductor packaging technology, and greater failure risk. Computer-aided engineering (CAE) tools are needed to evaluate, eliminate or mitigate susceptibilities to failure modes during MEMS device design.

Sherlock Automated Design Analysis™ software has proven to be a powerful tool in physics-based reliability modeling for MEMS miniaturized mechanical structures and their integration with electronic or electro-mechanical elements, into components and onto PCBs or other E/E device substrates.

Failure Analysis

The first step in failure analysis of automotive electronics is CAE modeling of a very specific configuration: a MEMS device integrated onto a multilayer organic interposer with other components to form a System in a Package (SiP) suitable for attachment to a PCB.

The Sherlock Automated Design Analysis™ CAE App uses Physics of Failure (PoF) to accommodate this level of modeling complexity. It nimbly models traces, vias and layer stack up geometries by automatically assigning material properties from its libraries and creating the microvia structures for every layer. 

From there, the Sherlock CAE App performs a variety of internal PoF durability simulations and reliability assessments on the MEMS model, including:

  • Thermal cycling solder attachment fatigue
  • Thermal cycling PCB PTH via barrel cracking fatigue
  • Vibration solder fatigue
  • Shock solder fracture
  • Actuarial (constant failure rate/MTBF calculations)
  • Conductive anodic filament risk
  • Stress load in fracture risk
  • ICT test stress analysis
  • Compliant pin connector insertion
  • ISO-26262 Functional Safety FMECA generator

High-Fidelity Modeling

Sherlock creates 3D stress plots for interposer substrates that board designers use to extrapolate a variety of reliability risk issues into predictive data, then apply it to MEMS layouts – allowing for design adjustments before any manufacturing takes place, and ensuring essential MEMS reliability and durability in high stress automotive environments.

Similarly, Sherlock automation of 3D FEA CAE model creation simplifies compliance with ISO-26262 Vehicle System Functional Safety requirements. Product designers and reliability experts, who generally are not trained in modeling, can interact with Sherlock CAE models to verify and optimize product reliability and durability without incurring the time and expense of prototype building and testing. 

MEMS reliability is critical for vehicle safety, and the Sherlock CAE App is the tool of choice for ensuring success. Learn more by downloading Predicting MEMS Package Level Failure Modes in Automotive Applications. Click the button below for your free copy of this informative webinar.

Predict MEMS Failure in automotive apps CTA

Topics: Sherlock, Design for Reliability

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