DfR Solutions Reliability Designed and Delivered

Overcoming Qualification Method Challenges for Semiconductor Devices in Avionics Systems

Posted by Ashok Alagappan on Jun 15, 2017 9:25:00 AM

When compared to the electronic systems in industries like commercial and industrial equipment, today’s avionics systems face several unique challenges. In addition to operating in rugged environments for long periods of time, they must also satisfy rigorous safety and reliability standards. Most importantly, unlike other industries, they must meet these standards while using commercial-off-the-shelf (COTS) semiconductor devices (logic, memory, etc.) and electronic assemblies that have been designed and qualified for other applications with less rigorous requirements.

Topics: Sherlock, Physics of Failure, Avionics

Read More

How Digital Image Correlation (DIC) Can Benefit Global Avionics

Posted by Mike Howard on May 18, 2017 9:13:00 AM

Global avionics continues to experience rapid growth. Being first to market with new, consistently reliable technology is key to staying ahead of the competition. Using non-destructive methods, like Digital Image Correlation (DIC), in avionic design and root cause analysis provides a fast, accurate way to help characterize material properties and measure displacements and deformation.

Topics: Design for Reliability, Test Plan Development, Avionics

Read More

4 Reliability Factors to Address With Avionics Systems Lifecycle Simulation

Posted by Ed Dodd on Apr 11, 2017 8:42:00 AM

Avionics systems are complex and often interdependent, as demonstrated in an aircraft cockpit that houses control, monitoring, communication, navigation, weather and anti-collision systems. These highly regulated electronics are among the most expensive and standardized products available—considerable investments that are expected to perform for up to 30 years, making the determination of product lifetime reliability a top priority.

Topics: Sherlock, Avionics

Read More

Reliability in Avionics: Using Virtual Prototyping, Simulation and PoF

Posted by Lloyd Condra on Mar 28, 2017 8:56:48 AM

Modern electronics have continued in the pattern of Moore’s Law which has decreased transistor size and increased performance. This necessitates development of faster, smaller ICs with greatly reduced power dissipation. However, the increased number of transistors in smaller spaces causes higher power density which can lead to higher failure rates, shorter device lifetimes and unanticipated early device wearout.

Topics: Physics of Failure, Avionics

Read More