printed circuit board
Digital Image Correlation (DIC) is a non-contact, full field displacement optical measurement technique.
It is most often used in the following applications:
- Material characterization (CTE, glass transition temperature, Young’s Modulus, Poisson’s Ratio)
- Sample testing – fatigue and failure (in situ monitoring of displacements and strains)
- Applications where displacement or deformation measurements are needed
- High speed/frequency applications (i.e. crash testing, vibration)
We perform dozens of failure analyses every month for our clients in various industries and identify many different root causes of failure. One that can be difficult to identify and prove is soldering flux residue. As circuit designs shrink and become more complex, flux residues are more likely to cause failure from leakage current.
LED Failure Modes,
Solder Joint Fatigue,
Sherlock Automated Design Analysis,
Power supply is the core of electronic equipment. But as crucial as it is, designing a power supply can be difficult due to an indirect feedback loop within design teams, especially when it comes to thermal solutions. It is often more difficult to know what the temperature should be as opposed to what the temperature will be.
As the smartphone market has stagnated, semiconductor manufacturers have started to pivot their focus to automotive electronics to find the next large volume growth opportunity. This adjustment is for good reason: while smartphone volumes have not changed in over three years, automotive electronics will be the fastest growing market for integrated circuits until at least 2021.
To be successful in the competitive landscape that is automotive electronics, semiconductor manufacturers must account for differences in how automotive OEMs and their suppliers qualify integrated circuits compared to consumer products. While the differences are numerous, a key factor is the critical importance of board level reliability testing.