We perform dozens of failure analyses every month for our clients in various industries and identify many different root causes of failure. One that can be difficult to identify and prove is soldering flux residue. As circuit designs shrink and become more complex, flux residues are more likely to cause failure from leakage current.
“After a failure” investigations are typically performed to identify root cause of failure, calculate risk exposure and develop mitigation and remediation solutions. Just like with “before a failure” investigation, there are two specific test methods that could be applied to either of the two categories – non-destructive physical analysis (NPA) and destructive physical analysis (DPA).
Failure analysis is the process of identifying, and typically attempting to mitigate, the root cause of a failure. In the electronics industry, failure analysis typically involves isolating the failure to a location on a printed circuit board assembly (PCBA) before collecting more detailed data to investigate which component or board location is functioning improperly.