As the power consumption of data center applications has grown, power devices have found their way into products across different market segments such as information technology, electric motor drives, grid infrastructure, automotive, and aerospace. This resurgence of wide-bandgap devices is not only driving growth by enabling high volume manufacturing and reduction in cost, but also innovation in material and packaging technologies lead to improvement in reliability and novel device types.
Power supply is the core of electronic equipment. But as crucial as it is, designing a power supply can be difficult due to an indirect feedback loop within design teams, especially when it comes to thermal solutions. It is often more difficult to know what the temperature should be as opposed to what the temperature will be.
WHAT is UNDERFILL AND WHY is it USEFUL?
Underfill is thermoset epoxies traditionally used in flip chip applications to reduce thermal stresses solder bumps experience due to coefficient of thermal expansion mismatch between a die and the organic substrate. Today, underfills are available in a variety of formulations and are widely used for board level reliability of ball grid array components by reducing thermal and mechanical loads under harsh use environments. Careful consideration to the underfill material properties and intended use environments must be made to assess the relative reliability improvements underfills offer.
A common feeling among many designers and users of military electronic systems is nostalgia. Nostalgia for the good old days when the electronics industry was almost the exclusive supply chain of the military. While almost all aspects of integrated circuits (ICs) have improved over the past few decades (better, faster, cheaper), many in the military still long for the day when almost every semiconductor device on the market met or exceed their requirements without even asking.