DfR Solutions Reliability Designed and Delivered

Underfill Applications, Materials & Methods

WHAT is UNDERFILL AND WHY is it USEFUL?

Underfill is thermoset epoxies traditionally used in flip chip applications to reduce thermal stresses solder bumps experience due to coefficient of thermal expansion mismatch between a die and the organic substrate. Today, underfills are available in a variety of formulations and are widely used for board level reliability of ball grid array components by reducing thermal and mechanical loads under harsh use environments. Careful consideration to the underfill material properties and intended use environments must be made to assess the relative reliability improvements underfills offer.

Topic: Electronics Reliability, Solder Joint Fatigue, solder joint, Mechanical Design, integrated circuits, Reliability Physics

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Exploring Semiconductor Reliability

A common feeling among many designers and users of military electronic systems is nostalgia.  Nostalgia for the good old days when the electronics industry was almost the exclusive supply chain of the military. While almost all aspects of integrated circuits (ICs) have improved over the past few decades (better, faster, cheaper), many in the military still long for the day when almost every semiconductor device on the market met or exceed their requirements without even asking.

Topic: Semiconductor technology, integrated circuits

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