Using FEA to identify Microvias and PTHs at Risk of Failure

Plated through holes (PTH) and vias are structures that interconnect signal circuits at different PCB layers. They are typically categorized as through vias (or PTH), blind vias, and buried vias. Due to the higher I/O density and smaller electronic packages evolving in the past decades, the demand for high density interconnects has increased significantly.

Topic: Sherlock, plated through via, via reliability, microvias, plated through holes, finite element analysis

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