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0.3mm Pitch Chip Scale Packages: Changes and Challenges

Posted by Author on Jul 25, 2016 4:02:06 PM

The movement to 0.3mm pitch in chip scale packages (CSPs) can be considered inevitable. The electronics industry is rarely willing to make a leap to a unproven technology will gradual improvements in existing processes are sufficient (Moore’s law being a classic example).

To successfully move to 0.3mm requires buy-in from the entire manufacturing industry, from the printed board manufacturer, to the solder paste supplier, to the stencil manufacturer, and a comprehensive understanding of the potential reliability risks the change in interconnect design may entail.


Topics: CSPs, PCB manufacturers, reliability

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