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Ensuring Suitability of Cu Wire Bonded ICs for Automotive Applications

Posted by James McLeish and Dr. Randy Schueller on Jul 11, 2016 11:00:00 PM

The transition to replace gold with copper bond wires in semiconductor components, primarily driven by the ever increasing price of gold wire, has been under way for several years. Cu wire bonds (Cu-WBs) are technically more challenging than gold to produce, requiring improved designs, processes and equipment. After introduction in consumer products, their use is now migrating to automotive electronics where product integrity for quality, reliability and durability (QRD) and safety over 10-15 years in a demanding harsh environment is paramount, in addition to managing cost in the highly competitive global automotive market.


Topics: CU wire bonded ICs, Automotive applications

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