Manual soldering and cleaning processes are among the least controlled processes in printed circuit boardassembly. As a result, they create special challenges to both quality and longterm reliability. This paper describes some of those key challenges and provides ways to address them in assembly to minimize problems.The topics to b ecovered include design considerations, general manual soldering recommendations material selection and qualification criteria, cleaning recommendations, process monitoring and control, relevant industry standards, and case study.
Through awareness of the issues, proper design and appropriate material selection and process control, companies can successfully use manual soldering and cleaning processes in high reliability products. Without proper planning, however, these processes can lead to a path of ruin.