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Understanding the Risk of Gold Flash

Posted by Craig Hillman and Randy Kong on Aug 31, 2016 11:18:28 PM

As the risk of depression fades and the electronics industry struggles to find its footing again, there must be due diligence in avoiding the same costreduction mistakes of prior generations of engineers. Examples include

Unsupported holes are just as robust as supported holes
Product qualification testing is too expensive and time consuming We don’t really need conformal coating
Can we reduce the gold thickness?

The later can be one of special concern, as the thickness of gold plating, and the quality, can play a key role in connector and interconnect reliability.

Topics: connectors, interconnects, gold flash

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Connector Design For Wearables

Posted by Dr. Randy Schueller on Jul 8, 2016 12:00:00 AM

As electronics continue to shrink and their performance capabilities grow, these electronics are becoming more and more integrated into our daily lives. The next step is the internet of everything and wearable electronics. Communication between devices and providing power through the use of connectors is critical; connector sales are a $50 billion/year industry.   As critical as they are, separable connectors are often times the first item to fail in electronics. This problem is only expected to worsen as electronics are used in increasingly challenging environments. This paper will discuss contact physics, contact plating options, normal force requirements and general tradeoffs that frequently occur when designing or selecting a connector for an application. Physics of failure along with a number of connector failure examples will be presented as well.

Topics: Physics of Failure, contact plating options, normal force requirements, contact physics, connectors

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