DfR Solutions Reliability Designed and Delivered

Reballed Ball Grid Array Reliability Under Shock and Vibration

Posted by Nathan Blattau and Joelle Arnold on Aug 30, 2016 4:20:18 PM

The electronics assembly market has experienced a material shift from lead (Pb) based solders to Pb-free solders. This is a result of the widespread adoption of Reduction of Hazardous Substances (RoHS) legislation and practices in commercial industry. As a result, it is becoming increasingly difficult to procure commercial off-the-shelf (COTS) components with tin-lead (SnPb) solder balls or finish.

Topics: COTS, Pb free Solders, BGAs

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