DfR Solutions Reliability Designed and Delivered

Factors that Drive LED Reliability

Posted by Author on Aug 23, 2016 11:33:50 AM

Semiconductor-based light emitting diode (LED) devices first appeared in the 1960s. Today, with the advances in materials, design and manufacture of LED devices, DfR is seeing a wide spectrum of LEDs that are cheaper, more colorful, more efficient, more intense, and more reliable. LED applications include signs and indicators, sensors, communication devices, displays, and increasingly solid state lighting and backlighting for TVs and monitors. The supply chain for LEDs can include producers of LED chips, packaging houses, LED driver chips and system integrators (e.g., LED light bulb). Large players in LED chip manufacture include Nichia, Philips, Osram and Cree.

LEDs provide unique advantages in solid state lighting due to their power efficiency and reliability. As an example, the Pharox 500 equivalent to a 60-watt conventional bulb from Lemnis Lighting (Figure 1) consumes 7 watts and lasts for ~25 years [1]. The cost is currently projected to be under $40 and can go down to $10 in five years driven by demand and improvements in the electronics. Philips predicts that LEDs will make up 80% of the general illumination market by 2020.

Topics: LED, Physics of Failure

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Integrated Circuit Reliability Prediction Based on Physics- of-Failure Models in Conjunction With Field Study

Reliability models, based on physics-of-failure mechanisms, have been developed for dynamic random access memories (DRAM), microcontrollers and microprocessors using a new software tool. Field data from a large fleet of mobile communications products, that were deployed over a period of 8 years, were analyzed to validate the tool’s accuracy. Strong correlation of 80% is demonstrated between measured and predicted values.

Topics: Failure Rate, Physics of Failure, reliability, AMC, Simulation

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Field Failure Early Warning System

Posted by Gregg Kittlesen on Aug 12, 2016 10:54:05 AM

A presentation at the recent Avionics Maintenance Conference (AMC) provides an interesting case study to test various early warning systems for the detection of rising field failure issues. Given the large number of organizational interfaces involved in any field failure and the costs associated with any investigation, many field failure issues fester for a significant period of time before the commitment is made to identify the root cause of failure. A defined issue detection process will provide data to decision makers, support the development of organizational knowledge databases, and enhance customer satisfaction. Limited information for this case study is publically available. The intent of this article is to compare various possible issue detection threshold processes. Some physics of failure considerations will also be presented.

Topics: AMC, Physics of Failure

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Instability, Metastability or Failure: Assessing the Reliability of 28nm FPGA Technology

Posted by Ed Wyrwas on Jul 14, 2016 12:36:13 PM

Space-bound systems use 65nm Radiation Hardened FPGA technologies that are nearing end-of-life (Xilinx Virtex 5QV). Rather than redevelop these systems using the next successor FPGAs at 40nm, which offers only a limited improvement in performance, the industry finds it necessary to skip this generation and start performing viability analyses on the 28nm FPGAs instead.

Although these FPGAs are said to be unprecedented in performance, their state-of-the-art 3D packages (see Figure 1) and 28nm feature sizes lack the empirical test data necessary for designers to make critical reliability decisions on whether this new technology is a suitable replacement for the Virtex 5 FPGAs. DfR Solutions will investigate the reliability of the Xilinx -7 Series 28nm products in this qualification activity.

Topics: FPGA, Physics of Failure

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Connector Design For Wearables

Posted by Dr. Randy Schueller on Jul 8, 2016 12:00:00 AM

As electronics continue to shrink and their performance capabilities grow, these electronics are becoming more and more integrated into our daily lives. The next step is the internet of everything and wearable electronics. Communication between devices and providing power through the use of connectors is critical; connector sales are a $50 billion/year industry.   As critical as they are, separable connectors are often times the first item to fail in electronics. This problem is only expected to worsen as electronics are used in increasingly challenging environments. This paper will discuss contact physics, contact plating options, normal force requirements and general tradeoffs that frequently occur when designing or selecting a connector for an application. Physics of failure along with a number of connector failure examples will be presented as well.

Topics: connectors, Physics of Failure, contact physics, contact plating options, normal force requirements

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Introduction to Physics of Failure Reliability Methods

Posted by Craig Hillman on Apr 6, 2016 12:40:14 PM
Topics: Physics of Failure

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