Integrated Circuit Reliability Prediction Based on Physics- of-Failure Models in Conjunction With Field Study

Reliability models, based on physics-of-failure mechanisms, have been developed for dynamic random access memories (DRAM), microcontrollers and microprocessors using a new software tool. Field data from a large fleet of mobile communications products, that were deployed over a period of 8 years, were analyzed to validate the tool’s accuracy. Strong correlation of 80% is demonstrated between measured and predicted values.

Topics: Physics of Failure, AMC, Failure Rate, Simulation, reliability

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