Guarantee Reliability with Thermal Cycling

Thursday, December 14 at 11:00 am

Presented by dr. Nathan Blattau

This webinar provides an overview of thermal cycling induced failures in printed circuit board assemblies. The two main failure modes that are explored are solder joint and plated through hole fatigue. A close examination of the effect of board properties will also be provided. We will discuss the usage of analytical and semi-analytical prediction methodologies.

Use the form to register for the Guarantee Reliability with Thermal Cycling webinar on Thursday,  December 14 at 11 am EST.