Vidyu Challa, Ph.D., Consulting Manager at ANSYS-DfR Solutions, recently joined Battery Power Online to discuss the latest trends in lithium-ion and battery reliability.
ANSYS ACQUIRES ASSETS OF ELECTRONICS AUTOMATED DESIGN ANALYSIS LEADER DfR SOLUTIONS
Acquisition gives customers access to premium electronics reliability technology
PITTSBURGH, May 1, 2019 – ANSYS (NASDAQ: ANSS), the global leader and innovator of engineering simulation software, announced today that it has acquired substantially all the assets of DfR Solutions, the developer of Sherlock, the industry’s only automated design reliability analysis software. ANSYS’ comprehensive multiphysics solutions, combined with Sherlock’s accurate reliability analyses, will provide a complete designer-level toolkit enabling customers to quickly and easily analyze for electronics failure earlier in the design cycle – saving users time and money during the development process.
Beltsville, MD – January 23, 2019 – DfR Solutions, pioneer in Reliability Physics Analysis and a leader in quality, reliability, and durability solutions for the electronics industry, today announced the newest release of Sherlock Automated Design Analysis™ software, version 6.1. This new version has two significant new features, Locked IP Models and Thermal Mechanical BGA Life Predictions. Combined, these new features give users even more powerful predictive capabilities along with the ability to protect critical competitive design advantages across the supply chain. These new features are particularly valuable in automotive, avionics, and other industries using cutting edge technology in challenging environments.
Greg Caswell Receives Lifetime Achievement Award Presented by International Microelectronics Assembly and Packaging Society
Beltsville, MD – October 2, 2018 – DfR Solutions, pioneer in Reliability Physics and leader in quality, reliability, and durability solutions for the electronics industry, today announced that Greg Caswell, Senior Member of the Technical Staff at DfR Solutions, has been awarded the 2018 Lifetime Achievement Award by the International Microelectronics Assembly and Packaging Society (IMAPS).
The Lifetime Achievement Award is given to a member of the Society who, in the opinion of the Lifetime Achievement Awards Selection Committee, has made exceptional, visible, and sustained impact on the microelectronics packaging industry in technology, business or both. Because this award recognizes long term and exceptional impact on the greater microelectronics industry, recipients of this award automatically become Life Members and Fellows of the Society.
Mr. Caswell has been a highly-regarded thought leader in the electronics contract manufacturing and component packaging industries for the past 45 years. Caswell is an industry expert in SMT, advanced packaging, printed board fabrication, circuit card assembly and bonding solutions using nanotechnology. He led application development for the RNT Nanofoil® and ensured a successful transition of product technology to Indium Corporation. Caswell continues to be the leading authority in NanoBonding® implementation for component mounting applications. During his 10-year tenure at DfR Solutions, he has worked on more than 300 client projects ranging from design reviews and failure analyses to on-site supplier audits across the globe. He continues to write highly sought-after technical papers, journal articles, and blogs and he is a popular webinar presenter. Mr. Caswell has presented over 250 papers at conferences all over the world and has taught courses at IMAPS, SMTA and IPC events. He helped design the first pick and place system used exclusively for SMT in 1978, edited and co-authored the first book on SMT in 1984 for ISHM, and built the first SMT electronics launched into space. Mr. Caswell has a B.S. in electrical Engineering from Rutgers University in New Brunswick, New Jersey and a B.A. in Management from St. Edwards University in Austin, Texas.
THE ONLY CAD TO CAE SOLUTION DELIVERING RELIABILITY PHYSICS PREDICTIONS
Beltsville, MD – September 26, 2018 – DfR Solutions, pioneer in Reliability Physics Analysis and leader in quality, reliability, and durability solutions for the electronics industry, today announced a major new release of its Sherlock Automated Design Analysis™ software, version 6.0, Sherlock for SOLIDWORKS 3D CAD Integration. This significant new release includes integration with SOLIDWORKS 2018 that now empowers all SOLIDWORKS users with the ability to predict product reliability before a prototype is ever built. Sherlock users will now be able to use one tool to complete complex, 3D design and reliability analyses. This groundbreaking new feature is democratizing the process of electronics design by bringing powerful, analytical tools to everyday designers of electronics.
The current key trends in electronic technology – Internet of Things (IoT), Electrification, and Autonomous Transportation – share a focus in bringing power and intelligence closer to our everyday environment. But, this intelligence requires innovative electronic hardware that has never lived outside a datacenter, office, or home. And this hardware must operate at reliability levels far beyond what is currently expected for mobile phones or gaming consoles. How to solve this design reliability and safety challenge within the timeframe and price expectations of consumers? Simulation and modeling. Specifically, Reliability Physics Analysis or RPA which uses knowledge of failure mechanisms to predict reliability and improve product performance.
With the new Sherlock for SOLIDWORKS 3D CAD integrated software, mechanical and electronics designers and engineers can now quickly and easily predict the reliable lifetime of entire PCBAs (Printed Circuit Board Assemblies) under real world conditions, before a product is ever built. Mechanical, electrical, or reliability engineers, even non-FEA experts, can now seamlessly import complex 3D objects into one tool and gain valuable insight into how mechanical structures, such as enclosures, batteries, thermal solutions, chassis, displays, and stiffeners influence and affect the robustness of electronics exposed to thermal and mechanical loads. This information is vital for simulating circuit card assemblies as close to reality as possible and improving overall product performance.
Beltsville, MD – July, 11, 2018 – DfR Solutions, pioneer in Reliability Physics and leader in quality, reliability, and durability solutions for the electronics industry, today announced that it will be giving two presentations at the Turbine Engine Technology Symposium (TETS) in Dayton, Ohio September 10-13, 2018. Dr. Craig Hillman, CEO, is presenting High Temperature Materials for Electronic Control Assemblies on Thursday, September 13 at 11:30 AM. Ed Dodd, VP of Business Development, is presenting Realize Faster Time-to-Market through a Reliability Physics-Based Approach on Wednesday, September 12 at 2 PM.
Beltsville, MD – June 15, 2018 – DfR Solutions, pioneer in Reliability Physics and leader in quality, reliability, and durability solutions for the electronics industry, today announced that it would be presenting two sessions at InterPACK, Packaging and Integration of Electronic and Photonic Microsystems, August 27 and 28 in San Francisco. Dr. Vidyu Challa will present How to Qualify Your Batteries to Prevent Failures and Thermal Events on August 27 and participate in the Women in Engineering Panel on August 28. Maxim Serebreni will present the paper, Experimental and Numerical Investigation of Underfill Materials on Thermal Cycle Fatigue of Second Level Solder Interconnects.
Beltsville, MD – June 14, 2018 – DfR Solutions, leader in quality, reliability, and durability (QRD) solutions for the electronics industry, today announced that Ed Dodd, Vice President of Business Development, is speaking about Board Level Testing at the NASA Electronic Parts and Packaging Program. Mr. Dodd’s session takes place on 2:30 PM on Thursday, June 21. DfR Solutions is a pioneer in Reliability Physics analysis and works closely with the Aerospace industry to improve electronics reliability and safety.
Beltsville, MD – June 5, 2018 – DfR Solutions, leader in quality, reliability, and durability (QRD) solutions for the electronics industry, today announced that Dr. Craig Hillman, CEO of DfR Solutions will present Autonomous Vehicle LIDAR Thermal Design and Field Durability Prediction at the Integrated Electronics Solution Forum (IESF) Conference in Plymouth, MI on September 19th, 2018.
Beltsville, MD – May 22, 2018 – DfR Solutions, the leader in quality, reliability, and durability (QRD) solutions for the electronics industry, today announced that it is presenting, Rapid and Accurate Reliability Analysis Through Nastran-Sherlock Integration, with Honeywell Aerospace at the Siemens PLM Connection - Americas June 4-7, 2018, in Phoenix, Arizona. Dr. Craig Hillman, CEO of DfR Solutions will be co-presenting with Randolph Hook, Staff Mechanical Engineer at Honeywell Aerospace on Wednesday, June 6 at 2:25 PM.