College Park, MD – March 26, 2007 – Joelle Arnold of DfR Solutions will present information on DfR’s recent research study: “Accelerated Life Testing of SN100C for Surface Mount Devices: Vibration” at the IPC/JEDEC Global Conference on Lead Free Reliability & Reliability Testing for RoHS Lead Free Electronics. The conference will be held April 10-12 in Boston, MA.
The need for a manufactuable, reliable lead-free solder is becoming increasingly important as Sn alloys containing Ag-Cu (SAC) experience difficulties in manufacturing and field performance. This report will detail DfR’s approach towards developing a physics-of-failure based life model for vibration of SN100C.
About DfR: DfR Solutions has world-renowned expertise in applying the science of Reliability Physics to electrical and electronics technologies, and is a leading provider of quality, reliability, and durability (QRD) research and consulting for the electronics industry. The company’s integrated use of Physics of Failure (PoF) and Best Practices provides crucial insights and solutions early in product design and development and throughout the product life cycle. DfR Solutions specializes in providing knowledge- and science-based solutions to maximize and accelerate the product integrity assurance activities of their clients in every marketplace for electronic technologies (consumer, industrial, automotive, medical, military, telecom, oil drilling, and throughout the electronic component and material supply chain).