Beltsville, MD – October 2, 2018 – DfR Solutions, pioneer in Reliability Physics and leader in quality, reliability, and durability solutions for the electronics industry, today announced that Greg Caswell, Senior Member of the Technical Staff at DfR Solutions, has been awarded the 2018 Lifetime Achievement Award by the International Microelectronics Assembly and Packaging Society (IMAPS).
The Lifetime Achievement Award is given to a member of the Society who, in the opinion of the Lifetime Achievement Awards Selection Committee, has made exceptional, visible, and sustained impact on the microelectronics packaging industry in technology, business or both. Because this award recognizes long term and exceptional impact on the greater microelectronics industry, recipients of this award automatically become Life Members and Fellows of the Society.
Mr. Caswell has been a highly-regarded thought leader in the electronics contract manufacturing and component packaging industries for the past 45 years. Caswell is an industry expert in SMT, advanced packaging, printed board fabrication, circuit card assembly and bonding solutions using nanotechnology. He led application development for the RNT Nanofoil® and ensured a successful transition of product technology to Indium Corporation. Caswell continues to be the leading authority in NanoBonding® implementation for component mounting applications. During his 10-year tenure at DfR Solutions, he has worked on more than 300 client projects ranging from design reviews and failure analyses to on-site supplier audits across the globe. He continues to write highly sought-after technical papers, journal articles, and blogs and he is a popular webinar presenter. Mr. Caswell has presented over 250 papers at conferences all over the world and has taught courses at IMAPS, SMTA and IPC events. He helped design the first pick and place system used exclusively for SMT in 1978, edited and co-authored the first book on SMT in 1984 for ISHM, and built the first SMT electronics launched into space. Mr. Caswell has a B.S. in electrical Engineering from Rutgers University in New Brunswick, New Jersey and a B.A. in Management from St. Edwards University in Austin, Texas.Mr. Caswell is teaching the course A Methodology for Understanding the Reliability of Electronic Packaging from 1pm to 3pm on Monday, October 8 at the 51st Annual IMAPS conference at the Pasadena Convention Center. He will be recognized for his lifetime of achievement during the presentation ceremony on Tuesday, October 9th during the President’s Party from 6pm to 8pm.
IMAPS is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging. Our Society offers 69 chapters around the globe, creating global networks of more than 3,000 members in the United States and an additional 3,000 members throughout Europe and Asia.
About DfR Solutions
DfR Solutions is world-renowned for its expertise in applying Reliability Physics Analysis to electronics technologies and is a leading provider of quality, reliability, and durability research and consulting to the electronics industry. The company pioneered the use of Reliability Physics with its innovative, Sherlock Automated Design Analysis™ software providing crucial insights and solutions early in product design and throughout the product life cycle. DfR Solutions empowers its customers to accelerate and maximize product development while saving time, managing resources, and improving customer satisfaction. The company supports Fortune 500 clients in every industry including aerospace/avionics, automotive, consumer, industrial, medical, military, solar and telecommunications. For more information about DfR Solutions, visit www.dfrsolutions.com.