College Park, MD – February 17, 2010 – DfR Solutions is pleased to announce that Dr. Craig Hillman and Greg Caswell will be presenting at the PV Module Reliability Workshop, February 18-19, 2010, at the Marriott Denver West in Golden, Colorado. Their presentation, entitled: “Insuring and Predicting the Reliability of Concentrated Photovoltaics: Interconnect Structure,” will discuss how concentrated photovoltaic system installations have a requirement to survive for 20-25 years in the field.
“It is necessary to simultaneously achieve the highest level of electrical performance and efficiency while also removing heat,” stated Dr. Craig Hillman, CEO and Managing Partner at DfR Solutions. “This combination leads to a reliability issue should the incorrect interconnection structure be implemented,” The paper will provide insight into a methodology utilizing a solder interface to meet these requirements.”
The challenge facing Concentrated Photovoltaic systems is that the current material selection for interconnects is insufficient as filled epoxy is only a ‘temporary’ solution and will be inappropriate above 1000 Suns. This means that installations will have insufficient reliability to meet 25-year lifetime.
“With CPV Reliability requirements being typically 25 years, understanding the reliability of a viable intermetallic interconnect is the prevalent method of achieving this objective,” said Greg Caswell of DfR Solutions.
Jordan Ross of the Indium Corporation expressed, “easy, proven methods of attachment using solder preforms will achieve these levels of reliability.
Extensive life requirements and short product development cycles demand ‘proof-of-concept’ before hardware build and require reliability prediction of interconnect structures in the concept and design stages. New materials by Indium Corporation and new reliability algorithms by DfR Solutions provide direct solutions to these industry-limiting issues.
For more information regarding DfR’s presentation, please contact Greg Caswell at email@example.com
DfR Solutions has world-renowned expertise in applying the science of Reliability Physics to electrical and electronics technologies, and is a leading provider of quality, reliability, and durability (QRD) research and consulting for the electronics industry. The company’s integrated use of Physics of Failure (PoF) and Best Practices provides crucial insights and solutions early in product design and development and throughout the product life cycle. DfR Solutions specializes in providing knowledge- and science-based solutions to maximize and accelerate the product integrity assurance activities of their clients in every marketplace for electronic technologies (consumer, industrial, automotive, medical, military, telecom, oil drilling, and throughout the electronic component and material supply chain). For more information visit www.dfrsolutions.com
About Indium Corporation of America:
Indium Corporation of America is an ISO 9001-registered developer, manufacturer, and supplier of specialty alloys and solders (including solder paste, solder preforms, solder spheres, solder wire, solder tubing, solder ribbon, and solder foil), solder fluxes, electrically-conductive adhesives, inorganic indium compounds (including indium oxide, indium-tin oxide, indium hydroxide, and indium chloride), fusible alloys, indium-containing fabrications of all types, and pure indium (from commercial grade through high-purity grade). The company is a five-time recipient of the Frost & Sullivan Award. Founded in 1934, Indium Corporation of America is based in Utica, New York, USA. It operates manufacturing facilities in China, England, Singapore, and the USA. The company has Sales offices at several locations throughout the world. For more information visit www.indium.com