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Greg Caswell Receives Lifetime Achievement Award Presented by International Microelectronics Assembly and Packaging Society

Posted by DfR Solutions on Oct 3, 2018 10:41:42 PM

Beltsville, MD – October 2, 2018 – DfR Solutions, pioneer in Reliability Physics and leader in quality, reliability, and durability solutions for the electronics industry, today announced that Greg Caswell, Senior Member of the Technical Staff at DfR Solutions, has been awarded the 2018 Lifetime Achievement Award by the International Microelectronics Assembly and Packaging Society (IMAPS).

The Lifetime Achievement Award is given to a member of the Society who, in the opinion of the Lifetime Achievement Awards Selection Committee, has made exceptional, visible, and sustained impact on the microelectronics packaging industry in technology, business or both. Because this award recognizes long term and exceptional impact on the greater microelectronics industry, recipients of this award automatically become Life Members and Fellows of the Society. 

Mr. Caswell has been a highly-regarded thought leader in the electronics contract manufacturing and component packaging industries for the past 45 years. Caswell is an industry expert in SMT, advanced packaging, printed board fabrication, circuit card assembly and bonding solutions using nanotechnology. He led application development for the RNT Nanofoil® and ensured a successful transition of product technology to Indium Corporation. Caswell continues to be the leading authority in NanoBonding® implementation for component mounting applications.  During his 10-year tenure at DfR Solutions, he has worked on more than 300 client projects ranging from design reviews and failure analyses to on-site supplier audits across the globe. He continues to write highly sought-after technical papers, journal articles, and blogs and he is a popular webinar presenter. Mr. Caswell has presented over 250 papers at conferences all over the world and has taught courses at IMAPS, SMTA and IPC events. He helped design the first pick and place system used exclusively for SMT in 1978, edited and co-authored the first book on SMT in 1984 for ISHM, and built the first SMT electronics launched into space. Mr. Caswell has a B.S. in electrical Engineering from Rutgers University in New Brunswick, New Jersey and a B.A. in Management from St. Edwards University in Austin, Texas.

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Sherlock Temperature-Based FEA Receives IPC APEX Innovation Award

Posted by DfR Solutions on Mar 2, 2018 1:13:22 PM

Beltsville, MD – March 2, 2018 – DfR Solutions, leader in quality, reliability, and durability (QRD) solutions for the electronics industry, today announced that the newest version of Sherlock Automated Design Analysis™ Software version 5.4 with Temperature-based FEA, has been awarded an IPC APEX EXPO Innovation Award. The IPC APEX EXPO Innovation Awards were created to honor outstanding products and services for the electronics industry. The award was presented to DfR Solutions at the IPC APEX EXPO during John Mitchell’s keynote on Wednesday, February 28, 2018.

Topics: Physics of Failure, reliability, Electronics Design, DfR Solutions, Reliability Physics

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DfR Solutions Earns ISO 9001.2015 certification

Posted by DfR Solutions on Feb 9, 2018 12:15:00 PM

Beltsville, MD – February 7, 2018 - DfR Solutions, the leader in quality, reliability, and durability (QRD) solutions for the electronics industry became ISO 9001:2015 certified on January 25, 2018. ISO 9001 is an internationally recognized standard for creating a quality management system.

Topics: Physics of Failure, reliability, Electronics Design, DfR Solutions, Reliability Physics

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Agenda  Announced for the 2018 Design for Reliability Conference

Posted by DfR Solutions on Jan 31, 2018 1:07:00 PM

Beltsville, MD – January 31, 2018 – DfR Solutions, the leader in quality, reliability, and durability (QRD) solutions for the electronics industry, has announced the agenda for its 2nd Annual Design for Reliability Conference on March 19-21, 2018 at the Hyatt Regency Baltimore Inner Harbor hotel in historic Baltimore, Maryland.  Pioneers from Automotive, Aerospace, and other industry authorities will join DfR Solutions’ experts to explore real-world applications of Physics of Failure that are solving today’s complex technology challenges.

Topics: Physics of Failure, reliability, Electronics Design, DfR Solutions, 2018 Design for Reliability Conference, Reliability Physics

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Announcing 2018 Design for Reliability Conference

Posted by DfR Solutions on Nov 7, 2017 2:21:00 PM

Beltsville, MD – November 7, 2017 – DfR Solutions, the leader in quality, reliability, and durability (QRD) solutions for the electronics industry, has announced that its 2018 Design for Reliability Conference will be held on March 19-21, 2018 at the Hyatt Regency Baltimore Inner Harbor hotel in historic Baltimore, Maryland. Pioneers from Automotive, Aerospace, and other industry thought-leaders will join DfR Solutions’ experts to explore real-world applications of Physics of Failure that are solving today’s complex technology challenges.

Topics: reliability, Electronics Design, DfR Solutions, 2018 Design for Reliability Conference

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Announcing Thermal-Mechanical Analysis in Sherlock Version 5.3

Posted by DfR Solutions on Sep 13, 2017 7:16:00 AM

Beltsville, MD – September 13, 2017 – DfR Solutions, leader in quality, reliability, and durability (QRD) solutions for the electronics industry, today announced the next release of Sherlock Automated Design Analysis™ software - Version 5.3. Advanced features include Thermal-Mechanical Analysis. This advanced new capability provides the ability to capture system-level effects on solder joint reliability during temperature cycling.

Topics: temperature cycling, reliability, DfR Solutions, Sherlock Automated Design Analysis, Thermal Mechanical Analysis, solder joint, Sherlock 5.3, system level effects

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Sherlock Automated Design Analysis™ Version 3.2 Introduces Hi-Fidelity PCB Modeling, Other Advances

Posted by DfR Solutions on Sep 9, 2014 9:30:00 AM

Beltsville, MD – September 9, 2014 – DfR Solutions, leader in quality, reliability, and durability (QRD) solutions for the electronics industry, today announced the newest release of Sherlock Automated Design Analysis™ software, version 3.2. This newest version of Sherlock incorporates several advanced features including Hi-Fidelity PCB Modeling, a Part and Package 3D Model Viewer, a Shared Parts Library feature, and Through-Hole Lead Modeling. These features, along with existing Sherlock features, enable users to model even more complex substrates and boards, faster, and more accurately than ever before.

Topics: DfR Solutions, Sherlock Automated Design Analysis

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Sherlock Automated Design Analysis™ Adds IPC Footprint Patterns

Posted by DfR Solutions on Sep 2, 2014 4:00:00 PM

Beltsville, MD – September 2, 2014 – DfR Solutions, leader in quality, reliability, and durability (QRD) solutions for the electronics industry, today announced that Sherlock Automated Design Analysis™ software package library now recognizes the IPC-7351B naming convention for standard SMT land patterns and the working draft of IPC-7251 for thru-hole land patterns. The IPC requirements provide generic requirements to be used for the surface attachment of electronic components as well as surface mount design recommendations for achieving the best possible solder joints to the devices assembled.

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DfR Solutions Continues to Grow Senior Team

Posted by DfR Solutions on Mar 10, 2014 12:00:00 PM

Beltsville, MD – March 10, 2014 – DfR Solutions, a leader in quality, reliability, and durability (QRD) solutions for the electronics industry, today announced a new appointment to its management team. Chris Montgomery will serve as Senior Vice President, in charge of Strategic Business Development and Marketing.

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Sherlock 3.1 Release Integrates ECAD and CAE Analysis

Posted by DfR Solutions on Jan 23, 2014 1:00:00 PM

Beltsville, MD – January 23, 2014 – DfR Solutions, leader in quality, reliability, and durability (QRD) solutions for the electronics industry, today announced the newest release of Sherlock Automated Design Analysis™ software, version 3.1.  This version of Sherlock is the first and only reliability tool to seamlessly interface with existing FEA tools.  Now engineers can quickly and accurately predict circuit card reliability across different use environments using their own FEA software.

Topics: DfR Solutions, Sherlock Automated Design Analysis

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