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Announcing Sherlock 6.1: Powerful Predictions and IP Protection across the supply chain

Posted by DfR Solutions on Jan 23, 2019 9:00:00 AM

Beltsville, MD – January 23, 2019 – DfR Solutions, pioneer in Reliability Physics Analysis and a leader in quality, reliability, and durability solutions for the electronics industry, today announced the newest release of Sherlock Automated Design Analysis™ software, version 6.1. This new version has two significant new features, Locked IP Models and Thermal Mechanical BGA Life Predictions. Combined, these new features give users even more powerful predictive capabilities along with the ability to protect critical competitive design advantages across the supply chain. These new features are particularly valuable in automotive, avionics, and other industries using cutting edge technology in challenging environments.

Topics: Sherlock Automated Design Analysis, Thermal Mechanical Analysis, Reliability Physics

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Announcing Sherlock Automated Design Analysis™ for SOLIDWORKS® 3D CAD

Posted by DfR Solutions on Sep 26, 2018 1:37:55 PM

THE ONLY CAD TO CAE SOLUTION DELIVERING RELIABILITY PHYSICS PREDICTIONS

Beltsville, MD – September 26, 2018 – DfR Solutions, pioneer in Reliability Physics Analysis and leader in quality, reliability, and durability solutions for the electronics industry, today announced a major new release of its Sherlock Automated Design Analysis™ software, version 6.0, Sherlock for SOLIDWORKS 3D CAD Integration.  This significant new release includes integration with SOLIDWORKS 2018 that now empowers all SOLIDWORKS users with the ability to predict product reliability before a prototype is ever built. Sherlock users will now be able to use one tool to complete complex, 3D design and reliability analyses. This groundbreaking new feature is democratizing the process of electronics design by bringing powerful, analytical tools to everyday designers of electronics.

The current key trends in electronic technology – Internet of Things (IoT), Electrification, and Autonomous Transportation – share a focus in bringing power and intelligence closer to our everyday environment. But, this intelligence requires innovative electronic hardware that has never lived outside a datacenter, office, or home. And this hardware must operate at reliability levels far beyond what is currently expected for mobile phones or gaming consoles. How to solve this design reliability and safety challenge within the timeframe and price expectations of consumers? Simulation and modeling. Specifically, Reliability Physics Analysis or RPA which uses knowledge of failure mechanisms to predict reliability and improve product performance.

With the new Sherlock for SOLIDWORKS 3D CAD integrated software, mechanical and electronics designers and engineers can now quickly and easily predict the reliable lifetime of entire PCBAs (Printed Circuit Board Assemblies) under real world conditions, before a product is ever built.  Mechanical, electrical, or reliability engineers, even non-FEA experts, can now seamlessly import complex 3D objects into one tool and gain valuable insight into how mechanical structures, such as enclosures, batteries, thermal solutions, chassis, displays, and stiffeners influence and affect the robustness of electronics exposed to thermal and mechanical loads. This information is vital for simulating circuit card assemblies as close to reality as possible and improving overall product performance.

Topics: Sherlock, Sherlock Automated Design Analysis, Reliability Physics

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Realize Faster Time-to-Market through a Reliability Physics-Based Approach

Posted by DfR Solutions on Jul 11, 2018 9:00:00 AM

Beltsville, MD – July, 11, 2018 – DfR Solutions, pioneer in Reliability Physics and leader in quality, reliability, and durability solutions for the electronics industry, today announced that it will be giving two presentations at the Turbine Engine Technology Symposium (TETS) in Dayton, Ohio September 10-13, 2018. Dr. Craig Hillman, CEO, is presenting High Temperature Materials for Electronic Control Assemblies on Thursday, September 13 at 11:30 AM. Ed Dodd, VP of Business Development, is presenting Realize Faster Time-to-Market through a Reliability Physics-Based Approach on Wednesday, September 12 at 2 PM.

Topics: Aerospace, Reliability Physics

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DfR Solutions to Tackle Thermal Issues in Electronics at InterPACK

Posted by DfR Solutions on Jun 15, 2018 2:52:51 PM

Beltsville, MD – June 15, 2018 – DfR Solutions, pioneer in Reliability Physics and leader in quality, reliability, and durability solutions for the electronics industry, today announced that it would be presenting two sessions at InterPACK, Packaging and Integration of Electronic and Photonic MicrosystemsAugust 27 and 28 in San Francisco.  Dr. Vidyu Challa will present How to Qualify Your Batteries to Prevent Failures and Thermal Events on August 27 and participate in the Women in Engineering Panel on August 28. Maxim Serebreni will present the paper, Experimental and Numerical Investigation of Underfill Materials on Thermal Cycle Fatigue of Second Level Solder Interconnects.

Topics: Reliability Physics

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DfR Solutions Discusses Board and Box Level Qualification

Posted by DfR Solutions on Jun 14, 2018 2:08:17 PM

Beltsville, MD – June 14, 2018 – DfR Solutions, leader in quality, reliability, and durability (QRD) solutions for the electronics industry, today announced that Ed Dodd, Vice President of Business Development, is speaking about Board Level Testing at the NASA Electronic Parts and Packaging Program. Mr. Dodd’s session takes place on 2:30 PM on Thursday, June 21. DfR Solutions is a pioneer in Reliability Physics analysis and works closely with the Aerospace industry to improve electronics reliability and safety.

Topics: Reliability Physics

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Autonomous Vehicle LIDAR Thermal Design and Field Durability Prediction Addressed

Posted by DfR Solutions on Jun 5, 2018 2:54:00 PM

Beltsville, MD – June 5, 2018 – DfR Solutions, leader in quality, reliability, and durability (QRD) solutions for the electronics industry, today announced that Dr. Craig Hillman, CEO of DfR Solutions will present Autonomous Vehicle LIDAR Thermal Design and Field Durability Prediction at the Integrated Electronics Solution Forum (IESF) Conference in Plymouth, MI on September 19th, 2018.

Topics: Reliability Physics, Autonomous Vehicles

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DfR Solutions to Present at Siemens PLM Connection

Posted by DfR Solutions on May 22, 2018 9:00:00 AM

Beltsville, MD – May 22, 2018 – DfR Solutions, the leader in quality, reliability, and durability (QRD) solutions for the electronics industry, today announced that it is presenting, Rapid and Accurate Reliability Analysis Through Nastran-Sherlock Integration, with Honeywell Aerospace at the Siemens PLM Connection - Americas June 4-7, 2018, in Phoenix, Arizona. Dr. Craig Hillman, CEO of DfR Solutions will be co-presenting with Randolph Hook, Staff Mechanical Engineer at Honeywell Aerospace on Wednesday, June 6 at 2:25 PM.

Topics: Reliability Physics

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DfR Solutions Addresses Mission Critical Impact on Electronics Reliability

Posted by DfR Solutions on May 14, 2018 9:08:00 AM

Beltsville, MD – May 14, 2018 – DfR Solutions, leader in quality, reliability, and durability (QRD) solutions for the electronics industry, today announced that Dr. Craig Hillman, CEO of DfR Solutions is speaking at the IPC High Reliability Forum for Mil-Aero and Automotive Sectors in Linthicum, Maryland, taking place May 15-17, 2018. Dr. Hillman will present System-Level Effects on Solder Joint Reliability on Thursday, May 17 at 10:45 AM. Dr. Hillman is a preeminent authority on electronics design reliability. DfR Solutions works closely with Aerospace and Automotive industries to improve electronics reliability and safety.

Topics: solder joint reliability, Reliability Physics

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Sherlock Temperature-Based FEA Receives IPC APEX Innovation Award

Posted by DfR Solutions on Mar 2, 2018 1:13:22 PM

Beltsville, MD – March 2, 2018 – DfR Solutions, leader in quality, reliability, and durability (QRD) solutions for the electronics industry, today announced that the newest version of Sherlock Automated Design Analysis™ Software version 5.4 with Temperature-based FEA, has been awarded an IPC APEX EXPO Innovation Award. The IPC APEX EXPO Innovation Awards were created to honor outstanding products and services for the electronics industry. The award was presented to DfR Solutions at the IPC APEX EXPO during John Mitchell’s keynote on Wednesday, February 28, 2018.

Topics: Physics of Failure, reliability, Electronics Design, DfR Solutions, Reliability Physics

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DfR Solutions Earns ISO 9001.2015 certification

Posted by DfR Solutions on Feb 9, 2018 12:15:00 PM

Beltsville, MD – February 7, 2018 - DfR Solutions, the leader in quality, reliability, and durability (QRD) solutions for the electronics industry became ISO 9001:2015 certified on January 25, 2018. ISO 9001 is an internationally recognized standard for creating a quality management system.

Topics: Physics of Failure, reliability, Electronics Design, DfR Solutions, Reliability Physics

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