Announcing Thermal-Mechanical Analysis in Sherlock Version 5.3

Posted by DfR Solutions on Sep 13, 2017 7:16:00 AM

Beltsville, MD – September 13, 2017 – DfR Solutions, leader in quality, reliability, and durability (QRD) solutions for the electronics industry, today announced the next release of Sherlock Automated Design Analysis™ software - Version 5.3. Advanced features include Thermal-Mechanical Analysis. This advanced new capability provides the ability to capture system-level effects on solder joint reliability during temperature cycling.

Topics: temperature cycling, reliability, DfR Solutions, Sherlock Automated Design Analysis, Thermal Mechanical Analysis, solder joint, Sherlock 5.3, system level effects

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