Do your products operate in extreme environments or require long lifetime performance? Then Sherlock Automated Design Analysis™ Software version 5.2 is for you. With the addition of the Semiconductor Wearout Analysis module, manufacturers with high performance, high reliability needs can evaluate and predict the risk of semiconductor wearout and assure optimal lifetime performance and reliability.
Over time, the semiconductors used in electronics components experience degradation and ultimately fail. The more complex the electronics, the more likely a failure will occur. Manufacturer’s testing is limited and industry specific requirements like MIL-HDBK-217, SR-332, and FIDES, are based on outdated statistical analyses that do not account for real world conditions. The Semiconductor Wearout Module in Sherlock 5.2 is a more accurate, physics-based prediction of semiconductor failure rates.
The Semiconductor Wearout Analysis module in Sherlock 5.2 uses a combination of publicly available data and physics of failure (PoF) degradation models to predict the minimum reliability of a component. By using PoF, this capability frees users from the limitations and inaccuracies inherent in assuming a constant failure rate and a simple Arrhenius relationship.
Different industries have different needs. Sherlock predicts semiconductor wearout 5 ways, from a basic prediction using field data and service life to a more complex analysis requiring temperature specific, test results, and calculated factors. Semiconductor Wearout Module Options include:
— User requires lifetime prediction for a given reliability and service life
— Data Source: User provides reliability from field data and service life
— User requires lifetime prediction based on temperature specific parameters
— Data Source: Manufacturer provides temperature specific prediction and user provides acceleration parameters
— User requires lifetime prediction based on component test results
— Data Source: Manufacturer or user provides test results and acceleration parameters
— User requires lifetime prediction based on temperature specific parameters and industry generic models and user defined parameters or Sherlock defined parameters
— Data Source: Manufacturer provides temperature specific prediction and uses user defined or Sherlock defined parameters to calculate acceleration factors
— User requires lifetime prediction based on test results and industry generic models and user defined or Sherlock defined parameters
— Data Source: Manufacturer provides or user provides test results and uses user defined or Sherlock defined parameters to calculate acceleration factors
In addition to groundbreaking semiconductor wearout analysis, Sherlock Version 5.2 provides users with:
IPC-2581 Full Function Mode Files Import and Support that enables them to create a new project within Sherlock or to define a new circuit card within an existing project. This import process is like other supported import formats like ODB++; IPC-2581 is an open global standard for assembly and manufacturing data supported by the IPC-2581 Consortium.
Part Modeling with the capability to selectively enable and disable FEA modeling for a specific part.
Modified Lead Modeling method that utilizes multiple elements, as needed, to model lead feet and shoulders. This modified method produces better FEA results for leads with long feet and/or shoulders.
A common feeling among many designers and users of military electronic systems is nostalgia. Nostalgia for the good old days when the electronics industry was almost the exclusive supply chain of the military. While almost all aspects of integrated circuits (ICs) have improved over the past few decades (better, faster, cheaper), many in the military still long for the day when almost every semiconductor device on the market met or exceed their requirements without even asking.
As leaders in quality, reliability and durability (QRD) solutions for the electronics industry, we at DfR Solutions are always innovating—as exemplified by the just-released Sherlock Automated Design Analysis™ software Version 5.2 that takes electronics design reliability analysis to the next level.