ANSYS DfR reversed_white

Ball Grid Arrays are surface mount packages used for integrated circuits (ICs). These high-density packages are particularly advantageous due their high number of interconnection pins. Using the Blattau approach, this calculator will compute the strain energy occurring in the corner and die shadow solder joints. Using the resulting information, it will predict the number of cycles to failure due to thermal cycling.

CTA-Calculator-Icon.png

Copy gives a brief description of the content available for download.

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CTA-Calculator-Icon.png

Copy gives a brief description of the content available for download.

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