ANSYS DfR reversed_white

Ceramic chips are surface mount packages used most commonly for passive components. This calculator will assess the coefficient of thermal expansion (CTE) mismatch between the component and the board. With this information, it will predict the number of cycles to failure due to the prescribed thermal conditions.  

CTA-Calculator-Icon.png

Copy gives a brief description of the content available for download.

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CTA-Calculator-Icon.png

Copy gives a brief description of the content available for download.

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