QFP/SOIC/TSOP are surface mount packages with gullwing lead geometries extending from each of the four sides. These packages are used for integrated circuits (ICs). This calculator evaluates the solder joint fatigue due to the thermal profile provided, using the Blattau model. The result is a prediction of the number of cycles to failure for the specified component.

CTA-Calculator-Icon.png

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CTA-Calculator-Icon.png

Copy gives a brief description of the content available for download.

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