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Quad Flat No-Lead (QFN) packages are surface mount packages that are becoming increasingly popular in consumer electronics and electronics for high reliability applications. This calculator evaluates solder joint fatigue due to the thermal profile provided, using the Blattau model. The result is a prediction of the number of cycles to failure driven by the package geometries and coefficient of thermal expansion (CTE) of the component and board materials.
CTA-Calculator-Icon.png

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CTA-Calculator-Icon.png

Copy gives a brief description of the content available for download.

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