Reliability and Manufacturability of Microvias/Plated Through Holes in PCB 

Thursday, February 28th at 11:00 AM EST

Presented by Dr. Kourosh M. Kalayeh

Due to the higher I/O density and smaller electronic packages in the past decades, the demand for high density interconnects (HDIs) has increased significantly.  Microvias are essential elements in HDI Printed Circuit Boards (PCBs) and the failures of these structures are among the most common causes of open circuit in these types of boards.  This has created great concern for the reliability of microvias within electronics industry.

In this webinar, Dr. Kalayeh will briefly discuss common failure mechanisms in microvias and plated through holes, and highlight their differences.  He will also identify common manufacturing defects and how they influence the reliability of these structures.

Dr. Kalayeh will then explore the challenges and pitfalls associated with the modeling of these devices using the method of finite elements, as well as the importance of statistical analysis on fatigue life prediction of PTHs.  Recommendations and guidelines will be offered to overcome these challenges. 

Finally, Dr. Kalayeh will provide a new, fully automated approach to analyze complex PCB designs and identify the configurations that are susceptible to failure.

Key Takeaways:

  • Failure mechanism in PTHs and microvia structures
  • Common manufacturing defects in microvia and PTHs
  • The challenges of microvia/via modeling
  • A new, fully automated approach to analyze complex PCB designs for interconnects prone to failure

Register for the webinar Reliability and Manufacturability of Microvias/Plated Through Holes in PCB on Thursday, February 28th at 11:00 am EST by filling out the registration form. We hope to you are able to attend!