The expert engineers and reliability professionals at DfR Solutions are thought leaders in electronics reliability. We’ve compiled a wide-range knowledge base of topics on failure. Click a category below to access whitepapers, webinars and more. 

Failure Modes and Mechanisms

17 Equations That Changed The World - Part 1
17 Equations That Changed The World - Part 2
A Change In Paradigm: Maximum Tin Whisker Lengths Just Got Longer
A New (Better) Approach To Tin Whisker Mitigation
A New Method for Testing Electrolytic Capacitors to Compare Life Expectancy
Accelerated Aluminum Electrolytic Capacitor Life Testing
Accelerating Auto Electronics Reliability Using Physics Of Failure Modeling
Accurate Quantitative Physics-Of-Failure Approach To Integrated Circuit Reliability
Alternative Pb-Free Alloys
Assure Reliable Performance of Semiconductors in Aerospace and Other High Performance Industries
Automated Design Analysis: Comprehensive Modeling Of Circuit Card Assemblies
Best Practices in Accelerating FEA in Abaqus, Ansys, and NX Nastran
Best Practices in Avoiding Pad Cratering and Capacitor Cracking
Best Practices in Implementing Physics of Failure into the Design Process
Best Practices in Thermal Derating
Coatings and Pottings for Solar Panel Systems. Issues and Solutions
Contamination And Cleanliness Challenges
Creating a HALT Test Plan with Sherlock
Creep Corrosion Of Electronic Assemblies In Harsh Environments
Creep Corrosion On Lead-Free Printed Circuit Boards
Crossing the Chasm from ECAD to CAE
Defining Sherlock Life Cycle Environments
Derating Is NOT Always The Answer
Derating Of Schottky Diodes
Design For Reliability At The Board Level
Design For Reliability Of Electronics In Automotive Applications
Design for Reliability Best Practices
Design for Reliability With Computer Modeling
Designing And Qualifying Chip-Scale Packages
Developing Damage Models for Solder Joints Exposed to Complex Stress States
Electronics Protection for Solar Panel Systems; Junction Boxes and Inverters: Issues and Challenges
Ensuring Suitability Of Cu Wire Bonded ICs For Automotive Applications
Factors That Drive LED Reliability
Flex Circuit Supplier Intervention
Guarantee Reliability with Mechanical Shock Simulation
Guarantee Reliability with Potting and Coating
Guarantee Reliability with Thermal Cycling
Guarantee Reliability with Vibration Simulation and Testing
How Mitigation Techniques Affect Reliability Results For BGAs
How to Make the Best Flip Chip BGA in the World
Improve Thermal Derating Using Sherlock and Abaqus
Instability, Metastability Or Failure Of 28nm FPGA Technology
Integrated Circuit Reliability Prediction Based On Physics-Of-Failure Models In Conjunction With Field Study
Integrating Design and Reliability: The Power of Physics of Failure
Integrating Sherlock Automated Design Analysis™ software with Abaqus
Introduction to Physics of Failure Reliability Methods
Let It Flow
Long-Term Storage of Aluminum E-Capacitors
Manufacturability & Reliability Challenges With Leadless Near Chip Scale (LNCSP) Packages In Pb-Free Processes
Meeting The Target Of 25 Year Reliability In Solar Electronics
Model PCBs with Greater Detail Than Ever Before
Modeling Printed Circuit Boards with Sherlock 3.2
Moisture In Hermetic Packages
Next Generation Power Electronics National Manufacturing Innovation Institute
Non-Functional Pads: Should They Stay or Should They Go?
Opto-Electronics: The Secret To Success
Part Quality: How to Test, When to Test, and What Does it all Mean?
Performing a Solder Fatigue Analysis with Sherlock and Abaqus is Fun!
Physics Of Failure
Physics Of Failure Durability Simulations Accelerate Development And Improve Reliability And Safety Of Automotive Electronics
Physics of Failure Simulation and Modeling Specifications
Predicting Fatigue of Solder Joints Subjected to High Number of Power Sources
Predicting Package Level Failure Modes In Multi-Layered Packages
Predicting The Reliability Of Zero-Level TSVs
Preventing CAF Formation With Reliable PCB Design
Preventing Pad Cratering During ICT
Quality And Reliability Challenges For Package-On-Package
Reballed Ball Grid Array Reliability Under Shock And Vibration
Reliability Issues For Optical Transceivers
Reliability Modeling Of Electronics For Co-Designed System Applications
Reliability Modeling Software Helps Designers Get A Jump On Testing
Reliability of Next Generation ICs: CPU, GPU, and FPGAs
Reliable Plated Through Hole Webinar
Reliable Plated Through Via Design And Fabrication
Reliable Plated Through-Via Design And Fabrication
Review Of Models For Time-To-Failure Due To Metallic Migration Mechanisms
Select the Right Mitigation for BGAs and QFNs
Sherlock 3.0 Solving Board and Product Level Vibration and Shock
Sherlock Automated Design Analysis™ Software Parts Wizard Patterns
Sherlock: Rapid Feedback On Product Design
Solder Attachment Reliability
Solving Problems of Overly Constrained Boards
Surviving the Heat Wave: Thermally Induced Failures and Reliability Risks Created by Advancements in Electronics Technologies
System Level Effects on Solder Joint Reliability
Temperature And Humidity Acceleration Factors On MLV Lifetime
Temperature Cycling and Fatigue in Electronics
Temperature Cycling And Fatigue In Electronics (White Paper)
Temperature Cycling in Electronics
Temperature Cycling of Coreless Ball Grid Arrays, DfR Solutions Open House
Temperature Dependence Of Electrical Overstress
Test Plan Development
The Complexities Of A Lead-Free Transition
The Suitability of Copper Wire Bonded ICs for High Reliability/Harsh Environment Electronic Applications
The Suitability of Cu-Wire Bond ICs in Automotive and Other Harsh Environments
The Tin Myth
Thermal Cycling And Fatigue
Thermal Management: How Hot Is Too Hot?
Thermo-Mechanical Reliability and the Latest Prediction Tools
Thermo-Mechanical and Mechanical Reliability of Electronics
Think Twice About That Low Tg Underfill
Tin Whiskers Assessment
TRIAC Specifications And Recommendations (Turn-On Behavior)
Understanding The Criticality Of Stencil Aperture Design And Implementation For A QFN Package
Understanding the Reality of New, High Reliability Solders
Uprating Of Crystal Oscillators
Uprating Of Electrolytic Capacitors
Using Physics of Failure to Improve Product Development and Reliability

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