Modeling & Simulation Resources

Best Practices in Accelerating FEA in Abaqus, Ansys, and NX Nastran
Crossing the Chasm from ECAD to CAE
Common Mistakes in Embedded System Design
Developing Damage Models for Solder Joints Exposed to Complex Stress States
Discussion on Cracking/Separation in Filled Vias
Guarantee Reliability with Mechanical Shock Simulation
Improve Thermal Derating Using Sherlock and Abaqus
Integrating Sherlock Automated Design Analysis™ Software with Abaqus
Performing a Solder Fatigue Analysis with Sherlock and Abaqus is Fun!
Predicting Component Warpage and Package Level Failure Modes

17 Equations That Changed The World - Part 1
17 Equations That Changed The World - Part 2
A Review of Reliability Tools and Paradigms for Effectiveness and Best Practices
A Solder Joint Reliability Model For LEDs Using Physics Of Failure
Accelerating Auto Electronics Reliability Using Physics Of Failure Modeling
Accurate Quantitative Physics-Of-Failure Approach To Integrated Circuit Reliability
Assure Reliable Performance of Semiconductors in Aerospace and Other High Performance Industries
Automated Design Analysis: Comprehensive Modeling Of Circuit Card Assemblies
Best Practices in Accelerating FEA in Abaqus, Ansys, and NX Nastran
Best Practices in Avoiding Pad Cratering and Capacitor Cracking
Best Practices in Implementing Physics of Failure into the Design Process
Best Practices in Thermal Derating
Bridging the Gap from ECAD to CAE
Circuit Analysis Success Stories
Cloud and Data Center Reliability, DfR Solutions Open House
Condition Based Maintenance: A Predictive Approach for Electronics
Creating a HALT Test Plan with Sherlock
Crossing the Chasm from ECAD to CAE
Design For Reliability At The Board Level
Design For Reliability Of Electronics In Automotive Applications
Design For Reliability With Computer Modeling
Design for Reliability Best Practices
Developing a Robust Memory Strategy
Developing Damage Models for Solder Joints Exposed to Complex Stress States
DfR Solutions: Your Partner Throughout The Product Life Cycle, DfR Solutions Open House
System Level Effects on Solder Joint Reliability
Effective Reliability Test Plan Development using Physics of Failure
Exploring Failure Modes and Mechanisms in Electronics
Guarantee Reliability with Mechanical Shock Simulation
Guarantee Reliability with Potting and Coating
Guarantee Reliability with Thermal Cycling
Guarantee Reliability with Vibration Simulation and Testing
HALT and Sherlock Automated Design Analysis™ Software
How Can Design Review Improve Your Product?
How Sherlock Can Help You, Now and Into the Future
How to Make the Best Flip Chip BGA in the World
How to Use Thermal Mechanical Analysis to Identify System Level Effects on Solder Fatigue
Improve Thermal Derating Using Sherlock and Abaqus
Integrated Circuit Reliability Prediction Based On Physics-Of-Failure Models In Conjunction With Field Study
Integrating Design and Reliability: The Power of Physics of Failure
Integrating Sherlock Automated Design Analysis™ software with Abaqus
Introduction to Design for Reliability
Introduction to Physics of Failure Reliability Methods
Learn about Automated Design Analysis with Greg Caswell
Meeting The Target Of 25 Year Reliability In Solar Electronics
Model PCBs with Greater Detail Than Ever Before
Modeling and Simulation of Electronics
Modeling Printed Circuit Boards with Sherlock 3.2
No MTBF Do You Know MTBF?
Overcoming 25 Year Life Reliability Challenges In Solar Electronics
Overview Of New DoD Reliability Revitalization Initiatives & MIL-HDBK-217 Update Efforts
Performing a Solder Fatigue Analysis with Sherlock and Abaqus is Fun!
Physics Of Failure
Physics Of Failure Durability Simulations Accelerate Development And Improve Reliability And Safety Of Automotive Electronics
Physics Of Failure Durability Simulations For Automotive Electronics
Predict Semiconductor Wearout with Sherlock 5.2
Predicting Component Warpage and Package Level Failure Modes
Predicting MEMS Package Level Failure Modes In Automotive Applications
Predicting Package Level Failure Modes In Multi-Layered Packages
Preventing CAF Formation With Reliable PCB Design
Preventing Pad Cratering During ICT
Quantitatively Analyzing The Performance Of Integrated Circuits And Their Reliability
Rapid and Definitive Simulation of Next Generation Electronics
Reliability 360: How to Verify Design Robustness Early in the Process
Reliability Challenges Facing Autonomous Vehicles
Reliability Modeling Of Electronics For Co-Designed System Applications
Reliability Modeling Software Helps Designers Get A Jump On Testing
Reliability of Next Generation ICs: CPU, GPU, and FPGAs
Reliability of Power Modules using Sherlock
Reliable Implementation of COTS Parts and Assemblies into Aerospace Systems
Reliable Plated Through Hole Webinar
Replacing MTBF/MTTF With Bx/Lx Reliability Metrics
RoHS + Update
Root Cause Analysis of HALT Failures
Select the Right Mitigation for BGAs and QFNs
Sherlock 3.0 Solving Board and Product Level Vibration and Shock
Sherlock Automated Design Analysis™ Software Parts Wizard Patterns
Sherlock: Rapid Feedback On Product Design
Sherlock 5.0's Features
Sherlock: Where It’s Been And Where It’s Going, DfR Solutions Open House
Solder Attachment Reliability
Solving Problems of Overly Constrained Boards
Test Plan Development: How To Do It
The Reliability of Wearable Electronics
The Secret to Low Cost, High Reliability Power Supplies
Thermal Management: How Hot Is Too Hot?
Thermo-Mechanical Reliability and the Latest Prediction Tools
Thermo-Mechanical and Mechanical Reliability of Electronics
Using Physics of Failure to Improve Product Development and Reliability
Using Sherlock to Benefit HALT Testing
Wearable Technology Design: Are You Up To The Challenge?
Wearables that Work: Getting it Right the First Time
Wireless Reliability in the Internet of Things (IoT) World
Your Partner Throughout the Product Development Life-cycle

17 Equations That Changed The World - Part 1
17 Equations That Changed The World - Part 2
A Review of Reliability Tools and Paradigms for Effectiveness and Best Practices
A Solder Joint Reliability Model For LEDs Using Physics Of Failure
Accelerating Auto Electronics Reliability Using Physics Of Failure Modeling
Accurate Quantitative Physics-Of-Failure Approach To Integrated Circuit Reliability
Assure Reliable Performance of Semiconductors in Aerospace and Other High Performance Industries
Automated Design Analysis: Comprehensive Modeling Of Circuit Card Assemblies
Avoid Critical Connector Failures in Challenging Environments
Best Practices in Accelerating FEA in Abaqus, Ansys, and NX Nastran
Best Practices in Avoiding Pad Cratering and Capacitor Cracking
Best Practices in Implementing Physics of Failure into the Design Process
Best Practices in Thermal Derating
Bridging the Gap from ECAD to CAE
Condition Based Maintenance: A Predictive Approach for Electronics
Connector Design for Wearables
Creating a HALT Test Plan with Sherlock
Crossing the Chasm from ECAD to CAE
Defining Sherlock Life Cycle Environments
Design For Reliability At The Board Level
Design for Reliability Best Practices
Design For Reliability Of Electronics In Automotive Applications
Design For Reliability With Computer Modeling
Design For Reliability: PCBs
Designing And Qualifying Chip-Scale Packages
Developing a Robust Memory Strategy
Developing Damage Models for Solder Joints Exposed to Complex Stress States
DfR Solutions: Your Partner Throughout The Product Life Cycle, DfR Solutions Open House
Effective Reliability Test Plan Development using Physics of Failure
Exploring Failure Modes and Mechanisms in Electronics
Failure Analysis in Electronics
Guarantee Reliability with Mechanical Shock Simulation
Guarantee Reliability with Potting and Coating
Guarantee Reliability with Thermal Cycling
Guarantee Reliability with Vibration Simulation and Testing
HALT and Sherlock Automated Design Analysis™ Software
How Can Design Review Improve Your Product?
How Sherlock Can Help You, Now and Into the Future
How to Use Thermal Mechanical Analysis to Identify System Level Effects on Solder Fatigue
Improve Thermal Derating Using Sherlock and Abaqus
Integrated Circuit Reliability Prediction Based On Physics-Of-Failure Models In Conjunction With Field Study
Integrating Design and Reliability: The Power of Physics of Failure
Integrating Physics of Failure (PoF) into Complex Systems
Integrating Sherlock Automated Design Analysis™ software with Abaqus
Introduction to Design for Reliability
Introduction to Physics of Failure Reliability Methods
Learn About Automated Design Analysis with Greg Caswell
Long-Term Storage of Aluminum E-Capacitors
Manufacturability & Reliability Challenges With Leadless Near Chip Scale (LNCSP) Packages In Pb-Free Processes
Meeting The Target Of 25 Year Reliability In Solar Electronics
Model PCBs with Greater Detail Than Ever Before
Modeling and Simulation of Electronics
Modeling Printed Circuit Boards with Sherlock 3.2
Overcoming 25 Year Life Reliability Challenges In Solar Electronics
Overview Of New DoD Reliability Revitalization Initiatives & MIL-HDBK-217 Update Efforts
Performing a Solder Fatigue Analysis with Sherlock and Abaqus is Fun!
Physics Of Failure
Physics Of Failure Durability Simulations Accelerate Development And Improve Reliability And Safety Of Automotive Electronics
Physics Of Failure Durability Simulations For Automotive Electronics
Physics of Failure Simulation and Modeling Specifications
Predict Semiconductor Wearout with Sherlock 5.2
Predicting MEMS Package Level Failure Modes In Automotive Applications
Preventing CAF Formation With Reliable PCB Design
Preventing Pad Cratering During ICT
Rapid and Definitive Simulation of Next Generation Electronics
Reliability Challenges Facing Autonomous Vehicles
Reliability Modeling Of Electronics For Co-Designed System Applications
Reliability Modeling Software Helps Designers Get A Jump On Testing
Reliability of Next Generation ICs: CPU, GPU, and FPGAs
Reliability of Power Modules using Sherlock
Reliable Implementation of COTS Parts and Assemblies into Aerospace Systems
Reliable Plated Through Hole Webinar
Replacing MTBF/MTTF With Bx/Lx Reliability Metrics
Review Of Models For Time-To-Failure Due To Metallic Migration Mechanisms
RoHS + Update
Root Cause Analysis of HALT Failures
Select the Right Mitigation for BGAs and QFNs
Sherlock 3.0 Solving Board and Product Level Vibration and Shock
Sherlock Automated Design Analysis™ Software Parts Wizard Patterns
Sherlock: Rapid Feedback on Product Design
Sherlock: Where It’s Been And Where It’s Going, DfR Solutions Open House
Shock Related Failures and Fatigue of Electronics
Solder Attachment Reliability
System Level Effects on Solder Joint Reliability
Temperature Cycling in Electronics
Test Plan Development Using Physics Of Failure, DfR Solutions Open House
Test Plan Development
Test Plan Development: How To Do It
The Reliability of Wearable Electronics
The Reliability of Wearable Electronics, DfR Solutions Open House
The Secret to Low Cost, High Reliability Power Supplies
The Transition From MTTF Reliability Predictions To Physics Of Failure Reliability Assessments
Thermal Management: How Hot Is Too Hot?
Thermo-Mechanical Reliability and the Latest Prediction Tools
Thermo-Mechanical and Mechanical Reliability of Electronics
This Is Not A Test
Using Physics of Failure to Improve Product Development and Reliability
Vehicle Prognostics
Wearable Electronics Reliability Challenges and Real World Solutions in Printed Electronics
Wearable Technology Design: Are You Up To The Challenge?
Wireless Reliability in the Internet of Things (IoT) World
Your Partner Throughout the Product Development Life-cycle

17 Equations That Changed The World - Part 1
17 Equations That Changed The World - Part 2
A Review of Reliability Tools and Paradigms for Effectiveness and Best Practices
Accelerating Auto Electronics Reliability Using Physics Of Failure Modeling
Are GPUs Reliable Enough for Autonomous Vehicles?
Automated Design Analysis: Comprehensive Modeling Of Circuit Card Assemblies
Autonomous Maintenance And Health Monitoring Of Rechargeable Batteries
Avoid Critical Connector Failures in Challenging Environments
Best Practices in Accelerating FEA in Abaqus, Ansys, and NX Nastran
Best Practices in Avoiding Pad Cratering and Capacitor Cracking
Best Practices in Implementing Physics of Failure into the Design Process
Best Practices in Thermal Derating
Beyond Bearing Wearout: Why Current Testing Of Fans Is Insufficient And Understanding DfR’s Solution
Bridging the Gap from ECAD to CAE
Characterization Of CEM-1 Boards
Coatings and Pottings for Solar Panel Systems. Issues and Solutions
Cold Plate Technology
Condition Based Maintenance: A Predictive Approach for Electronics
Creating a HALT Test Plan with Sherlock
Crossing the Chasm from ECAD to CAE
Defining Sherlock Life Cycle Environments
Derating Is NOT Always The Answer
Design For Reliability At The Board Level
Design For Reliability Of Electronics In Automotive Applications
Design For Reliability With Computer Modeling
Designing And Qualifying Chip-Scale Packages
Developing a Robust Memory Strategy
Developing Damage Models for Solder Joints Exposed to Complex Stress States
Electrostatic Discharge (ESD): A Potentially Dominant Failure Mechanism
Ensuring Suitability Of Cu Wire Bonded ICs For Automotive Applications
Get The Lead Out
Guarantee Reliability with Mechanical Shock Simulation
Guarantee Reliability with Potting and Coating
Guarantee Reliability with Thermal Cycling
HALT and Sherlock Automated Design Analysis™ Software
How to Use Thermal Mechanical Analysis to Identify System Level Effects on Solder Fatigue
Improve Thermal Derating Using Sherlock and Abaqus
Improved Efficiency and Reliability for Data Center Servers Using Immersion Cooling Technology
Integrating Design and Reliability: The Power of Physics of Failure
Integrating Sherlock Automated Design Analysis™ software with Abaqus
Introduction to Design for Reliability
Introduction to Physics of Failure Reliability Methods
Learn About Automated Design Analysis
Let It Flow
Manufacturability & Reliability Challenges With Leadless Near Chip Scale (LNCSP) Packages In Pb-Free Processes
Model PCBs with Greater Detail Than Ever Before
Modeling Printed Circuit Boards with Sherlock 3.2
Overview of Copper Pillar Technology
Performing a Solder Fatigue Analysis with Sherlock and Abaqus is Fun!
Physics of Failure Simulation and Modeling Specifications
Predicting Fatigue of Solder Joints Subjected to High Number of Power Sources
Predicting Package Level Failure Modes in Multi-Layered Packages
Preventing CAF Formation With Reliable PCB Design
Projection Lamp Failure Analysis
Quality And Reliability Challenges For Package-On-Package
Quantitatively Analyzing The Performance Of Integrated Circuits And Their Reliability
Rapid Strength Assessment Technique For AMLCDs
Reliability 360: How to Verify Design Robustness Early in the Process
Reliability Modeling Of Electronics For Co-Designed System Applications
Reliability of Power Modules Using Sherlock
Reliable Plated Through Hole Webinar
Review Of Models For Time-To-Failure Due To Metallic Migration Mechanisms
RoHS + Update
Root Cause Analysis of HALT Failures
Select the Right Mitigation for BGAs and QFNs
Sherlock Automated Design Analysis™ Software Parts Wizard Patterns
Sherlock: Rapid Feedback on Product Design
Shock Related Failures and Fatigue of Electronics
Solder Attachment Reliability, SMTA West Penn Chapter meeting
Surviving the Heat Wave: Thermally Induced Failures and Reliability Risks Created by Advancements in Electronics Technologies
System Level Effects on Solder Joint Reliability
Temperature Cycling and Fatigue in Electronics
Temperature Cycling in Electronics
Temperature Cycling of Coreless Ball Grid Arrays, DfR Solutions Open House
Temperature Dependence Of Electrical Overstress
Test Plan Development Using Physics of Failure
Test Plan Development: How To Do It
The Reliability of Wearable Electronics
The Secret to Low Cost, High Reliability Power Supplies
The Suitability of Copper Wire Bonded ICs for High Reliability/Harsh Environment Electronic Applications
Thermal Cycling And Fatigue
Thermal Management: How Hot Is Too Hot?
Thermal Uprating: The When And How
Thermo-Mechanical Reliability and the Latest Prediction Tools
Thermo-Mechanical and Mechanical Reliability of Electronics, IEEE CPMT Webinar
Understanding the Reality of New, High Reliability Solders
Upgrading The Component Derating Process
Uprating Of Crystal Oscillators
Uprating Of Electrolytic Capacitors
Uprating Of Magnetic Components
Uprating Of Plastic Axial Fans
Using Physics of Failure to Improve Product Development and Reliability
Wearable Electronics Reliability Challenges and Real World Solutions in Printed Electronics
Wearable Technology Design: Are You Up To The Challenge?
Wireless Reliability in the Internet of Things (IoT) World
You Cannot Pass Or Fail HALT

3 Fundamentals to the Ultimate Reliability in Consumer Electronics
17 Equations That Changed The World - Part 1
17 Equations That Changed The World - Part 2
Accelerating Auto Electronics Reliability Using Physics Of Failure Modeling
Automated Design Analysis: Comprehensive Modeling Of Circuit Card Assemblies
Avoid Critical Connector Failures in Challenging Environments
Best Practices in Accelerating FEA in Abaqus, Ansys, and NX Nastran
Best Practices in Avoiding Pad Cratering and Capacitor Cracking
Best Practices in Implementing Physics of Failure into the Design Process
Bridging the Gap from ECAD to CAE
Condition Based Maintenance: A Predictive Approach for Electronics
Creating a HALT Test Plan with Sherlock
Crossing the Chasm from ECAD to CAE
Defining Sherlock Life Cycle Environments
Design For Reliability At The Board Level
Design For Reliability Of Electronics In Automotive Applications
Design for Reliability With Computer Modeling
Developing a Robust Memory Strategy
Developing Damage Models for Solder Joints Exposed to Complex Stress States
Extreme Drop Testing
Get The Lead Out
Guarantee Reliability with Mechanical Shock Simulation
Guarantee Reliability with Potting and Coating
Guarantee Reliability with Thermal Cycling
Guarantee Reliability with Vibration Simulation and Testing
HALT and Sherlock Automated Design Analysis™ Software
Improve Thermal Derating Using Sherlock and Abaqus
Integrating Design and Reliability: The Power of Physics of Failure
Integrating Sherlock Automated Design Analysis™ software with Abaqus
Introduction to Design for Reliability
Introduction to Physics of Failure Reliability Methods
Learn About Automated Design Analysis
Leave No Technology Behind
Model PCBs with Greater Detail Than Ever Before
Modeling Printed Circuit Boards with Sherlock 3.2
Performing a Solder Fatigue Analysis with Sherlock and Abaqus is Fun!
Physics Of Failure Durability Simulations Accelerate Development And Improve Reliability And Safety Of Automotive Electronics
Physics of Failure Simulation and Modeling Specifications
Predict Semiconductor Wearout with Sherlock 5.2
Predicting Package Level Failure Modes In Multi-Layered Packages
Preventing CAF Formation With Reliable PCB Design
Preventing Pad Cratering During ICT
Quality And Reliability Challenges For Package-On-Package
Quantitatively Analyzing The Performance Of Integrated Circuits And Their Reliability
Reballed Ball Grid Array Reliability Under Shock And Vibration
Reliability 360: How to Verify Design Robustness Early in the Process
Reliability Modeling Of Electronics For Co-Designed System Applications
Reliability of Power Modules Using Sherlock
Reliable Plated Through Hole Webinar
RoHS + Update
Root Cause Analysis of HALT Failures
Select the Right Mitigation for BGAs and QFNs
Sherlock 3.0 Solving Board and Product Level Vibration and Shock
Sherlock Automated Design Analysis™ Software Parts Wizard Patterns
Shock Related Failures and Fatigue of Electronics
Solder Attachment Reliability
Test Plan Development Using Physics of Failure
Test Plan Development: How To Do It
The Reliability of Wearable Electronics
Thermo- Mechanical Reliability and the Latest Prediction Tools
Thermo-Mechanical and Mechanical Reliability of Electronics
Using Physics of Failure to Improve Product Development and Reliability
Wearable Electronics Reliability Challenges and Real World Solutions in Printed Electronics
Wearable Technology Design: Are You Up To The Challenge?
Wireless Reliability in the Internet of Things (IoT) World
You Cannot Pass or Fail HALT