Best Practices in Avoiding Pad Cratering and Capacitor Cracking
Identify and correct common causes of PCB failure
Today’s electronics are predisposed to failure if measures aren’t taken to mitigate risk.
Best Practices in Avoiding Pad Cratering and Capacitor Cracking explores:
- The various ways cracked capacitors and pad cratering can occur
- How to identify the differences between thermally induced and mechanically induced cracked capacitors
- The impact of materials selection and stress levels
- Corrective design and manufacturing actions