Reduce Electronic Failures With
Thermal Cycling

The majority of electronic failures are thermo-mechanically related.

Guaranteeing Reliability with Thermal Cycling explores the causes of – and solutions to – thermally induced stresses and strains, including:

  • Fatigue in plated through holes and solder joints
  • Board property influences
  • Excessive differences in coefficient of thermal expansion
  • Materials modeling

Reliability Communications: MTBF. Is there a better way? webinar