Avoid Assembly Failure Caused By Shock Or Drop

Mechanical overloads generated during a shock/drop event produce unpredictable overstress failures.

In Investigating Shock Related Failures of Electronic Assemblies you’ll find details on how reliability testing and analysis can detect the consequences of – and reveal solutions for – shock/drop event failure, including:

  • Pad catering
  • Intermetallic fracture
  • Interconnect fracture
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