PREDICTING PACKAGE LEVEL FAILURE MODES IN MULTILAYERED PACKAGES
Software tools and interposer modeling combine to find causes of package failure
Finding and addressing failure modes is critical to multilayer packages successfully keeping pace with silicon technologies. Designers armed with in-depth knowledge about package component reliability can adjust package layouts prior to costly errors occurring during manufacturing.
Our Predicting Package Level Failure Modes in Multilayered Packages webinar explores:
- Software tools that predict several package failure modes
- A methodology for creating a high-fidelity interposer model with all conductor geometries
- Package warpage prediction due to copper imbalance and filled microvia delamination