Predicting MEMS Package Level Failure Modes in Automotive Applications
Use physics of failure to optimize MEMS reliability and durability
Micro Electro-Mechanical Systems (MEMS) are increasingly being used to monitor and control safety critical vehicle systems, making ensuring their reliability and durability a top priority.
“Predicting MEMS Package Level Failure Modes in Automotive Applications” explores how physics of failure and Sherlock Automated Design Analysis™ software:
- Evaluates susceptibilities in MEMS failure modes, including Coefficient of Thermal Expansion (CTE) copper mismatch, filled microvia delamination and cracking stresses
- Creates a high-fidelity model and performs Physics of Failure (PoF) analysis of a MEMS device design to accurately assess and achieve functional safety levels of reliability and durability
- Assures compliance with stringent ISO-26262 Vehicle System Functional Safety requirements