Guaranteeing Reliability with Mechanical Shock Simulation
Use FEA analysis and Sherlock simulation to accurately identify and predict failure
Any time the yield stress of solder is exceeded, there is the potential for surface mount component failure. Shock, vibration and bending are typical causal events, but the resulting failures vary widely – excessive flexure, pad cratering, intermetallic fracture and component cracking.
Our Guaranteeing Reliability with Mechanical Shock Simulation webinar explores the wide variety of failure risks and compares two predictive mitigation testing and shock simulation approaches:
- The Steinberg Displacement-based method and its restrictions based on board shape/boundary condition limitations, and assumptions about natural board frequency and high displacement/high stress equivalency
- Finite Element Analysis (FEA) and the in-depth shock simulations Sherlock Automated Design Analysis™ software provides for assessing complex mode shape/boundary conditions, strain, curvature and more