Ensuring Stability of Copper Wire Bonded ICs for Automotive Applications
Mitigate risk and improve reliability with Physics of Failure
Semiconductor component wire bonds are transitioning from gold to copper – a smart economic move, but what does it mean for automotive application reliability?
This Suitability of Copper Wire Bonded ICs for Harsh Environment Electronic Applications webinar takes an in-depth look at the impact of Cu-WBs and how mitigating potential failure risks using Physics of Failure (PoF) maintains:
- Quality, reliability and durability (QRD)
- Automotive E/E integrity
- Safety, especially in harsh automotive environments
- Product reliability and consumer expectations surrounding it
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