“More than a picture-and-an-arrow”: DfR Solutions is the only third-party failure analysis organization worldwide that has the internal expertise to not only identify root-cause, but also provide clear recommendations on how to fix the problem and prevent it from reoccurring. DfR Solutions takes a multidisciplinary (electrical, mechanical, materials, physics, chemistry) approach to root cause analysis that is founded on the Physics of Failure (PoF) and enhanced by our team’s wide-ranging experience in electronic components, circuit boards, assembly, batteries, displays, housing/enclosure, motors, etc. Every failure analysis report released by DfR Solutions has a unique first page that details Key Findings and Recommended Actions. This allows our customers to quickly resolve issues, accelerate time to market, and drive continuous improvement within their organization.
DfR has been a valuable resource…
DfR has been a valuable resource not only for failure analysis, but also for mechanical analysis and part qualification testing. When I share the DfR reports with my managers and peers they also appreciate the expertise, timeliness and professionalism of the reports. I have had multiple co-workers from different groups within the company approach me about contacting DfR for help. I look forward to continuing to partner with DfR as I support projects at AEI, leveraging their strengths in FA, mechanical analysis, part qualification, BOM scrub, etc.
…Further insight and education is also provided…
I am truly satisfied with the Failure Analysis Investigation of DfR Solutions. In addition to identification of root cause for failure and failure mode of electronic devices/components, further insight and education is also provided regarding the type of failure! The staff is always available, well-versed and extremely professional.
They truly bring in the professional excellence!
We are very glad to have invited DfR Solutions in working on root cause failure analysis, process assessment and auditing, device testing methodologies, etc. Their work not only greatly improved our product integrity, but also raised our skills ranging from materials control and failure analysis to reliability process and methodologies. They truly bring in the professional excellence!
Failure analysis is the process of identifying, and typically attempting to mitigate, the root cause of a failure. In the electronics industry, failure analysis typically involves isolating the failure to a location on a printed circuit board assembly (PCBA) before collecting more detailed data to investigate which component or board location is functioning improperly.
To design robust products, it helps to understand how products fail in various types of environments. Product failure mechanisms can happen due to poor quality (defects built in) or the process of wear-out over long periods of time. Loads can be applied to products in many forms, electrically, chemically, mechanical force, etc. These loads cause stress and strain on elements of a product.
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