Integrated circuit (IC) components are part of nearly every major electronics application. However, up to this point, most reliability assessments focused on meeting the demand of consumer applications that last an average of five years. Today, many emerging market segments require reliable operations for 10 to 15 years, even in severe environments. Robust prediction of IC life in modern, high-reliability applications requires a different approach.

With a foundation in reliability and semiconductor physics, the ANSYS-DfR Solutions team uses simulation, test, and teardown analysis to define failure risk in specific applications and identify the key drivers of IC reliability. Whether you are trying to reduce component integration risk in a new application or trying to solve an IC reliability challenge in a severe environment, our experts have the experience and resources to help.

Traditional simulation and modeling techniques for ICs require extensive design, manufacturing, and test information that is not typically available to IC integrators and product designers. Our approach brings simulation and modeling within reach by using data they can typically acquire. Based on proven methods, our approach uses information about the technology node and functional blocks within the IC to predict susceptibility to hot carrier injection, negative bias temperature instability, time dependent dielectric breakdown, and other common IC failure mechanisms. We are able to simulate the reliability of ICs in application-specific environments and help designers mitigate IC reliability concerns early in the development process.

ANSYS-DfR Solutions also designs and conducts environmental testing of ICs under load and can evaluate bit errors and other signs of wear out through in-situ monitoring and failure analysis, as appropriate.

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Semiconductor SiC


Power Semiconductor Unique Capabilities In The New Use Environments

This resurgence of wide-bandgap devices is not only driving growth by enabling high volume manufacturing and reduction in cost, but also innovation in material and packaging technologies lead to improvement in reliability and novel device types. The two main technologies responsible for the growing list of applications for power devices are SiC (silicon carbide) and GaN (gallium nitride) due to their unique material properties. 


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Board Level Reliability Testing (BLRT) encompasses a range of environmental stress tests that evaluate Power devices are one of the most important and widely used components in industrial and automotive applications. Parameters that justify their use such as faster switching speeds, high breakdown voltage, and high ruggedness could be compromised by reliability issues arising from the manufacturing process and field application. Learn more common device types, their characteristics and reliability challenges.


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