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DfR Solutions has unrivaled experience in the mechanical, thermal, and electrical simulation and modeling of electronic/mechatronic components, products, and systems. Combined with our unique ability to perform material characterization onsite and deep knowledge of failure mechanisms (reliability physics), the team at DfR Solutions executes efficient and cost-effective simulation activities that provide our customers clear outcomes and actionable recommendations. The over 30 years of experience at DfR Solutions allow us to guide our customers as to what needs to be modeled, how it should be modeled, and what it all means.


DfR Solutions uses the latest versions of Solidworks, Sherlock, Abaqus, Ansys and NX Nastran to evaluate complex mechanical and thermomechanical loads and displacements that induce failures in electronic and mechatronic systems. Our analysis capabilities include static and dynamic, implicit and explicit, linear and non-linear, vibration and shock, and incorporates complex material behavior such as plasticity, fatigue, creep, wear, and crack initiation and propagation.

Thermal Simulation (Finite element analysis / computational fluid dynamics)

Temperature is one of the most critical drivers of product performance and reliability. DfR Solutions uses Solidworks, Sherlock, Abaqus and Ansys Icepak to help clients assess temperature rise due to power dissipation, optimize heat sink and forced air-flow parameters, to develop cost-effective thermal management strategies. The team at DfR Solutions is intimately familiar with all heat sources (semiconductors, batteries, motors, etc.) and thermal solutions (heat sinks, spreaders, heat pipes, coins, chimney design, fans, etc.) used in electronic and mechatronic systems.


Electrical issues are the leading cause of design revisions, test failures, and warranty issues for electronic and mechatronic systems. DfR Solutions uses MathCAD, Spice, Simplis, and Cadence OrCAD to capture the response behavior and voltage/current/power (VCP) stresses experienced within the electrical schematic. Simulation activities can focus on subcircuits or entire systems and can incorporate tolerance information from Sherlock’s component library to perform worst-case circuit analysis (WCCA). All circuit simulation activities come with a set of very specific recommended actions if issues or concerns are identified.

Simulation And Review

…prediction was borne out in our test results

Micron Technology solicited an FEA-based report from DfR Solutions analyzing warpage in an SSD design. Reporting was well organized, thorough and made it easy for us to comprehend the results. Additionally, Dr. Gil Sharon spent nearly an hour on the phone with me after I had read the report, making sure I understood all points of the analysis and the theories behind them. A couple of months later, Gil’s prediction was borne out in our test results – the process change dramatically improved our temp-cycle reliability. I plan to petition the SSD management at Micron to hire DfR Solutions to advise us on other matters in the near future.

Conner Earl, SSD Hardware Systems Mechanical Design Engineer
Micron Technology, Inc.

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