DfR Solutions Reliability Designed and Delivered


CTA-Training.pngThis course addresses the most important aspects of converting electronic assemblies to Pb-free (for RoHS compliance).

The emphasis is on how to ensure reliability for the components, the printed circuit board, and the completed assembly when transitioning to SAC Pb-free solder assembly. It answers questions such as:

  • What tin whisker mitigation strategies should be followed?
  • What board strain limits are acceptable and what should be done if solder fracture occurs due to high strain?
  • What PCB laminates are appropriate for Pb-free assembly and what parameters are important?
  • How do the surface finishes compare and in what applications do each fit best?
  • What are typical root causes of head-on-pillow defects and how are these defects eliminated?
  • Which capacitor types are most susceptible to Pb-free process damage?


  • The Presentation is available for viewing in five parts. Total Running Time: 3 hrs 26 min
  • Part 1: Necessary Processes and Documentation, Materials & Component Strategy: Solder Alloys – Running Time: 26 min
  • Part 2: Materials & Component Strategy: Component Qualification – Running Time: 23 min
  • Part 3: Materials & Component Strategy: PCB Laminates and Surface Finishes – Running Time: 48 min
  • Part 4: Assembly Processes – Running Time: 35 min
  • Part 5: Test and Analysis Strategy, Case Study – Running Time: 74 min


30 Days of Access