41st Annual EOS/ESD Symposium and Exhibits

Date: 09/15/2019-09/20/2019

Join us at the 41st Annual EOS/ESD Symposium And Exhibits Sept. 15th-20th, 2019 in Riverside, California. Ashok Alagappan, Lead Consulting Engineer at ANSYS Inc., will be presenting on Determining Absolute Maximum Ratings to Protect from Transient Electrical Overstress. There will also be an ANSYS booth during the exhibition portion of the event, where you can learn all about ANSYS' latest offerings and technology.

Topic: semiconductor integration, Semiconductor technology, Semiconductor Wearout, Semiconductor reliability

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Applied Reliability and Durability Conference Indianapolis 2019

Date: 09/17/2019-09/19/2019

Join us at the Applied Reliability and Durability Conference, occurring September 17-19, 2019 in Indianapolis, Indiana.  Jim McLeish, Principal Consulting Engineer at ANSYS-DfR Solutions, will be presenting SAE J3168: A New Standard for Reliability Physics Analysis (RPA) of Electronic Equipment, Modules and Components Using Computer Aided Engineering Durability Simulation. In addition to his presentation, Jim will be available to discuss ANSYS Sherlock and other ANSYS-DfR Solutions offerings at the conference and at on site visits within the region. 

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IMAPS: 52nd Symposium on Microelectronics

Date: 10/01/2019-10/03/2019

Join us at the 52nd Symposium on Microelectronics, presented by IMAPS on October 1st-3rd, 2019 in Boston, Massachusetts. Greg Caswell, Lead Consulting Engineer at ANSYS-DfR Solutions, will be presenting "Can Electrolytic Capacitors Meet the Demands of High Reliability Applications?" on Wednesday (Day 2), Oct. 2nd at 3:30 pm. Greg and Ken Symonds, Lead Consulting Engineer at ANSYS-DfR Solutions, will also be periodically available at booth #407 to discuss ANSYS-DfR Solutions' Reliability Engineering Services. 

Topic: Module Assembly, packaging, Electronics Packaging, microelectronics

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ASME Interpack 2019

Date: 10/07/2019-10/09/2019

Join us at the ASME Interpack 2019 on October 7th-9th, 2019 in Anaheim, California. Gil Sharon, Senior Application Engineer at ANSYS-DfR Solutions, will be presenting "Automated Method Using Finite Element Analysis to Identify Plated Through Holes and Microvia Stacks at Failure Risk in Complex PCB Designs" on Wednesday, Oct. 9th at 10:45 am as part of the technical track 8-1: ECU Level Reliability. 

Topic: printed circuit boards, Electronics Reliability, microvias, printed circuit board, plated through holes, finite element analysis

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10th Annual Battery Safety Summit

Date: 10/22/2019-10/25/2019

The 10th Annual Battery Safety Summit will be held October 22-25, 2019 in Alexandria, Virginia at the Westin Alexandria. The Battery Safety Summit provides a forum to continue the vital dialogue of integrating and implementing LIB safety to meet ever-increasing energy demands.

Topic: Reliability Physics, battery swelling, swollen battery, battery management system, lithium battery explosion, ion battery

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Advanced Automotive Battery Conference 2019

Date: 10/28/2019-10/31/2019

Join us at the Advanced Automotive Battery Conference in Tokyo, Japan from October 28th-31st, where Vidyu Challa, Consulting Manager at ANSYS Inc., will be presenting Li-Ion Cell Design and Manufacturing: Processes, Equipment and Quality Control.

Topic: Reliability Physics, battery swelling, swollen battery, battery management system, lithium battery explosion, ion battery

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