DfR Solutions Reliability Designed and Delivered

2018 InterPACK Packaging and Integration of Electronic and Photonic Microsystems

InterPACK 

Location: San Francisco, CA

Join us at the InterPACK Packaging and Integration of Electronic and Photonic Microsystems in San Francisco, August 27-30, 2018. For more information or to schedule a private meeting during the conference, please contact Ed Dodd at edodd@dfrsolutions.com.

Topics: DfR Solutions, Physics of Failure, Sherlock Automated Design Analysis