IMAPS: 52nd Symposium on Microelectronics

Posted by DfR Solutions on Sep 18, 2019 11:24:07 AM

Join us at the 52nd Symposium on Microelectronics, presented by IMAPS on October 1st-3rd, 2019 in Boston, Massachusetts. Greg Caswell, Lead Consulting Engineer at ANSYS-DfR Solutions, will be presenting "Can Electrolytic Capacitors Meet the Demands of High Reliability Applications?" on Wednesday (Day 2), Oct. 2nd at 3:30 pm. Greg and Ken Symonds, Lead Consulting Engineer at ANSYS-DfR Solutions, will also be periodically available at booth #407 to discuss ANSYS-DfR Solutions' Reliability Engineering Services. 

The 52nd International Symposium on Microelectronics is being organized by the International Microelectronics Assembly and Packaging Society (IMAPS). As our industry grows, we see a continuing trend where semiconductor products span many packaging platforms. As a result, we have maintained last year's technical program format where the tracks are alignment by package platform to improve the attendee's overall experience. Key package platforms include SiP/SiM/CPI, Wafer Level/Panel Level, 2.5D/3D/Flip Chip/Optical, as well as High Rel/Performance and Advanced Process/Materials. The technical committee has put together over 125 technical presentations and posters on today's most relevant topics in five parallel technical tracks.

October 1st-3rd, 2019

Hynes Convention Center
900 Boylston St, Boston, MA 02115
Boston, Massachusetts USA


Topics: Module Assembly, packaging, Electronics Packaging, microelectronics

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