DfR Solutions Reliability Designed and Delivered

2018 International Wafer-Level Packaging Conference

2018 IWLPC logoIWLPC-2017-Logo

Location: San Jose, CA

Join us at the 2018 International Wafer-Level Packaging Conference in San Jose, California October 23-25, 2018. Dr. Gil Sharon of DfR Solutions will discuss prediction methodologies for flip chip die and package level reliability in his professional development course, Modeling Failure Modes for Chip Package Interactions and Package Level ReliabilityIf you would like to schedule a meeting with Dr. Sharon while he is in town, please contact him at gsharon@dfrsolutions.com.

Topics: DfR Solutions, Reliability Physics